参数资料
型号: PCA9530D,118
厂商: NXP Semiconductors
文件页数: 20/24页
文件大小: 0K
描述: IC LED DRIVER RGB 8-SOIC
产品培训模块: LED Controllers
I²C Bus Fundamentals
标准包装: 1
拓扑: 开路漏极,PWM
输出数: 2
内部驱动器:
类型 - 主要: 背光,LED 闪烁器
类型 - 次要: RGB
频率: 400kHz
电源电压: 2.3 V ~ 5.5 V
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SO
包装: 标准包装
工作温度: -40°C ~ 85°C
产品目录页面: 825 (CN2011-ZH PDF)
其它名称: 568-1830-6
NXP Semiconductors
PCA9530
2-bit I 2 C-bus LED dimmer
? Process issues, such as application of adhesive and ?ux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
? Solder bath speci?cations, including temperature and impurities
15.4 Re?ow soldering
Key characteristics in re?ow soldering are:
? Lead-free versus SnPb soldering; note that a lead-free re?ow process usually leads to
higher minimum peak temperatures (see Figure 24 ) than a SnPb process, thus
reducing the process window
? Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
? Re?ow temperature pro?le; this pro?le includes preheat, re?ow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classi?ed in accordance with
Table 14 and 15
Table 14.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package re?ow temperature ( ° C)
Volume (mm 3 )
< 350
≥ 350
< 2.5
≥ 2.5
Table 15.
235
220
Lead-free process (from J-STD-020C)
220
220
Package thickness (mm)
Package re?ow temperature ( ° C)
Volume (mm 3 )
< 350
350 to 2000
> 2000
< 1.6
1.6 to 2.5
> 2.5
260
260
250
260
250
245
260
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during re?ow
soldering, see Figure 24 .
PCA9530_3
? NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 26 February 2009
20 of 24
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