参数资料
型号: PIC12C508AT-04/SN
厂商: Microchip Technology
文件页数: 3/113页
文件大小: 0K
描述: IC MCU OTP 512X12 8SOIC
产品培训模块: Asynchronous Stimulus
标准包装: 3,300
系列: PIC® 12C
核心处理器: PIC
芯体尺寸: 8-位
速度: 4MHz
外围设备: POR,WDT
输入/输出数: 5
程序存储器容量: 768B(512 x 12)
程序存储器类型: OTP
RAM 容量: 25 x 8
电压 - 电源 (Vcc/Vdd): 3 V ~ 5.5 V
振荡器型: 内部
工作温度: 0°C ~ 70°C
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
包装: 带卷 (TR)
配用: 309-1046-ND - ADAPTER 8-SOIC TO 8-DIP
309-1045-ND - ADAPTER 8-SOIC TO 8-DIP
AC124001-ND - MODULE SKT PROMATEII 8DIP/SOIC
PIC12C5XX
DS40139E-page 100
1999 Microchip Technology Inc.
Package Type:
K04-018 8-Lead Plastic Dual In-line (P) – 300 mil
* Controlling Parameter.
Dimension “B1” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B1.”
Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
0.310
0.267
0.245
0.355
0.120
0.005
0.060
0.140
0.006
0.000
0.055
0.014
Mold Draft Angle Bottom
Mold Draft Angle Top
Overall Row Spacing
Radius to Radius Width
Molded Package Width
Tip to Seating Plane
Base to Seating Plane
Top of Lead to Seating Plane
Top to Seating Plane
Upper Lead Width
Lower Lead Width
PCB Row Spacing
Package Length
Lead Thickness
Shoulder Radius
Number of Pins
Pitch
eB
β
α
L
E1
E
D
A2
A1
A
B
B1
R
c
n
p
Dimension Limits
Units
MIN
0.380
0.342
5
10
15
0.130
0.280
0.250
0.370
0.020
0.080
0.150
0.018
0.012
0.005
0.060
0.100
0.300
8
0.292
0.260
0.385
0.140
0.035
0.100
0.160
0.015
0.010
0.065
0.022
9.65
8.67
7.87
5
10
15
7.10
6.35
9.40
3.30
0.51
2.03
3.81
0.29
0.13
1.52
0.46
2.54
7.62
3.05
6.78
6.22
9.02
0.13
1.52
3.56
0.36
0.20
0.00
1.40
3.56
7.42
6.60
9.78
0.89
2.54
4.06
8
0.56
0.38
0.25
1.65
MIN
NOM
INCHES*
MAX
MILLIMETERS
NOM
MAX
n
1
2
R
D
E
c
β
eB
E1
α
p
A1
L
A
A2
B
B1
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