参数资料
型号: PIC18LF4331T-I/ML
厂商: Microchip Technology
文件页数: 64/119页
文件大小: 0K
描述: IC MCU FLASH 4KX16 44QFN
标准包装: 1,600
系列: PIC® 18F
核心处理器: PIC
芯体尺寸: 8-位
速度: 40MHz
连通性: I²C,SPI,UART/USART
外围设备: 欠压检测/复位,LVD,电源控制 PWM,QEI,POR,PWM,WDT
输入/输出数: 36
程序存储器容量: 8KB(4K x 16)
程序存储器类型: 闪存
EEPROM 大小: 256 x 8
RAM 容量: 768 x 8
电压 - 电源 (Vcc/Vdd): 2 V ~ 5.5 V
数据转换器: A/D 9x10b
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: 44-VQFN 裸露焊盘
包装: 带卷 (TR)
2010 Microchip Technology Inc.
DS39616D-page 49
PIC18F2331/2431/4331/4431
5.2
Master Clear (MCLR)
The MCLR pin can trigger an external Reset of the
device by holding the pin low. These devices have a
noise filter in the MCLR Reset path that detects and
ignores small pulses.
The MCLR pin is not driven low by any internal Resets,
including the Watchdog Timer.
In PIC18F2331/2431/4331/4431 devices, the MCLR
input can be disabled with the MCLRE Configuration
bit. When MCLR is disabled, the pin becomes a digital
input. For more information, see Section 11.5
.
5.3
Power-on Reset (POR)
A Power-on Reset pulse is generated on-chip when-
ever VDD rises above a certain threshold. This allows
the device to start in the initialized state when VDD is
adequate for operation.
To take advantage of the POR circuitry, tie the MCLR
pin through a resistor (1 k
to 10 k) to VDD. This will
eliminate external RC components usually needed to
create a Power-on Reset delay. The minimum rise rate
for VDD is specified (Parameter D004). For a slow rise
time, see Figure 5-2.
When the device starts normal operation (i.e., exits the
Reset condition), device operating parameters (such
as voltage, frequency and temperature) must be met to
ensure operation. If these conditions are not met, the
device must be held in Reset until the operating
conditions are met.
Power-on Reset events are captured by the POR bit
(RCON<1>). The state of the bit is set to ‘0’ whenever
a POR occurs and does not change for any other Reset
event. POR is not reset to ‘1’ by any hardware event.
To capture multiple events, the user manually resets
the bit to ‘1’ in software following any Power-on Reset.
FIGURE 5-2:
EXTERNAL POWER-ON
RESET CIRCUIT (FOR
SLOW VDD POWER-UP)
5.4
Brown-out Reset (BOR)
A Configuration bit, BOREN, can disable (if clear/
programmed) or enable (if set) the Brown-out Reset
circuitry. If VDD falls below VBOR (Parameter D005A
through D005F) for greater than TBOR (Parameter 35),
the brown-out situation will reset the chip. A Reset may
not occur if VDD falls below VBOR for less than TBOR.
The chip will remain in Brown-out Reset until VDD rises
above VBOR. If the Power-up Timer is enabled, it will be
invoked after VDD rises above VBOR; it then will keep
the chip in Reset for an additional time delay TPWRT
(Parameter 33). If VDD drops below VBOR while the
Power-up Timer is running, the chip will go back into a
Brown-out Reset and the Power-up Timer will be
initialized. Once VDD rises above VBOR, the Power-up
Timer will execute the additional time delay. Enabling
the Brown-out Reset does not automatically enable the
PWRT.
Note:
The following decoupling method is
recommended:
1. A 1
F capacitor should be connected
across AVDD and AVSS.
2. A
similar
capacitor
should
be
connected across VDD and VSS.
Note 1:
External Power-on Reset circuit is
required only if the VDD power-up slope is
too slow. The diode, D, helps discharge
the capacitor quickly when VDD powers
down.
2:
R < 40 k
is recommended to make
sure that the voltage drop across R does
not violate the device’s electrical
specification.
3:
R1
1 k will limit any current flowing
into MCLR from external capacitor, C, in
the event of MCLR/VPP pin breakdown,
due to Electrostatic Discharge (ESD) or
Electrical Overstress (EOS).
C
R1
R
D
VDD
MCLR
PIC18FXXXX
VDD
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