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参数资料
| 型号： | PowerPC 750CX |
| 厂商： | IBM Microeletronics |
| 英文描述： | 32-Bit Reduced Instruction Set Computer (RISC) Microprocessors(32位精简指令集微处理器) |
| 中文描述： | 32位精简指令集计算机（RISC）微处理器（32位精简指令集微处理器） |
| 文件页数： | 36/44页 |
| 文件大小： | 562K |
| 代理商： | POWERPC 750CX |
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PowerPC 750CX RISC Microprocessor Datasheet
Page 36
Version 1.1
November 13, 2000
7.6
Thermal Management Information
This section provides thermal management information for the PBGA package for air cooled applications. Proper ther-
mal control design is primarily dependent upon the system-level design and air flow.
7.7
Heat Sink Considerations
The PowerPC 750CX RISC Microprocessor package will support a maximum normal load of 2.2 kilograms. This load
includes the heat sink and any forces used to position or fasten the heat sink.
7.8
Internal Package Conduction Resistance
For the PBGA, described in Table 3 on page 12, the primary intrinsic conduction thermal resistance paths are as follows.
Die junction-to-case thermal resistance
Die junction-to-lead thermal resistance
Die junction-to-ambient thermal resistance
Figure 18 depicts the primary heat transfer path for this package.
Figure 17. IBM RISCWatch
TM
JTAG to HRESET, TRST, and SRESET Signal Connector
HRESET from RISCWatch
System HRESET
HRESET to PowerPC 750CX
TRST to PowerPC 750CX
SRESET to PowerPC 750CX
SRESET from RISCWatch
System SRESET
TRST from RISCWatch
Note: See notes for Table 16, “Input-Output Usage” on page 34.
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