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参数资料
型号： PRF21BE471QB5RA
厂商： Murata Electronics North America
文件页数： 26/105页
文件大小： 0K
描述： THERMISTOR
标准包装： 4,000
系列： PRF18/21
在 25°C 时的电阻（欧姆）： 470
电阻公差： ±50%
工作温度： -20°C ~ 100°C
安装类型： PCB，表面贴装
封装/外壳： 芯片
供应商设备封装： *
包装： *
! Note ? Please read rating and ! CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
? This catalog has only typical speci?cations. Therefore, please approve our product speci?cations or transact the approval sheet for product speci?cations before ordering.
R90E.pdf
Mar.4,2014
1
Chip Type Speci?cations and Test Methods
c PRG18/21BC Series
No.
1
Item
Operating Temp.
-10 to 60°C
Rating Value
Metheod of Examination
Temperature range with maximum voltage applied to PTC.
After applying maximum operating voltage for 3 mins. and
2
Resistance Value at 25°C
Within the specified range
leaving for 2 hours in 25°C, measured by applying voltage less
than DC1.5V. (by a direct current less than 10mA)
We apply 120% of the maximum operating voltage to PTC by
3
Withstanding Voltage
Without damage
raising gradually for 180±5 secs. at 25°C. (A protective resistor
is to be connected in series, and the inrush current through
PTC must be limited below maximum rated value.)
Reference standard: IEC 60068-2-21 (2006)
4
Adhesive Strength
There is no sign of exfoliation on electrode.
· Soldered PTC to PCB (**)
· Force: 5.0N
· Test time: 10 sec.
Reference standard: IEC 60068-2-6 (2007)
· Soldered PTC to PCB (**)
5
Vibration
· Appearance: No defects or abnormalities
· Resistance (R25) change: Less than ±20% (*)
· Frequency range: 10 to 55Hz
· Amplitude: 1.5mm
· Sweep rate: 1 octave/min.
· Direction: X-Y-Z (3 direction)
· 24 cycles in each axis
Reference standard: IEC 60068-2-58 (2004)
6
Solderability
Wetting of soldering area: U 75%
· Solder: Sn-3.0Ag-0.5Cu
· Solder temp.: 245±5°C
· Immersion time: 3±0.3s
Reference standard: IEC 60068-2-58 (2004)
[Reflow method]
· Solder: Sn-3.0Ag-0.5Cu
7
Resistance to Soldering Heat
· Appearance: No defects or abnormalities
· Resistance (R25) change: Less than ±20% (*)
· Preheat: +150 to +180°C, 120+/-5s
· Peak temp: 260+/-5°C
· Soldering time: U 220°C, 60 to 90s
· Reflow cycle: 1 time
· Test board: Grass-Epoxy test board (FR-4)
with our standard land size
Reference standard: IEC 60068-2-2 (2007)
8
9
High Temperature Storage
Low Temperature Storage
· Soldered PTC to PCB (**)
· +60±2°C
· 1000+48/-0 hrs.
Reference standard: IEC 60068-2-1 (2007)
· Soldered PTC to PCB (**)
· -10±3°C
· 1000+48/-0 hrs
Reference standard: IEC 60068-2-67 (1995)
10 Damp Heat, Steady State
11 Thermal Shock
· Appearance: No defects or abnormalities
· Resistance (R25) change: Less than ±20% (*)
· Soldered PTC to PCB (**)
· +60±2°C, 90±5%RH
· 500+24/-0 hrs
Reference standard: IEC 60068-2-14 (2009)
[ Test Na ]
· Soldered PTC to PCB (**)
· Transport time: <10 sec.
· Test condition: See below table
Step
1
2
Condition
-20±3°C
+85±2°C
Time
30min.
30min.
· Test cycle: 5 cycles
Reference standard: IEC 60068-2-2 (2007)
· Soldered PTC to PCB (**)
· +60±2°C
· Applied voltage: See below table
12 High Temperature Load
Step
1
2
Voltage
Max. voltage
OFF
Time
1.5hrs.
0.5hrs.
· 500+24/-0 hrs.
*: The resistance value after the test. It is measured by applying voltage less than DC1.5V (by a direct current less than 10mA) after left at 25±2°C for 2hrs.
**: Above mentioned soldering is done under the following conditions at our side.
· Glass-Epoxy PC board · Standard solder paste
· Standard land dimension · Standard solder profile
Above conditions are mentioned in Notice.
24
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