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参数资料
| 型号： | PRF21BE471QB5RA |
| 厂商： | Murata Electronics North America |
| 文件页数： | 90/105页 |
| 文件大小： | 0K |
| 描述： | THERMISTOR |
| 标准包装： | 4,000 |
| 系列： | PRF18/21 |
| 在 25°C 时的电阻（欧姆）： | 470 |
| 电阻公差： | ±50% |
| 工作温度： | -20°C ~ 100°C |
| 安装类型： | PCB，表面贴装 |
| 封装/外壳： | 芯片 |
| 供应商设备封装： | * |
| 包装： | * |
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! Note ? Please read rating and ! CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
? This catalog has only typical speci?cations. Therefore, please approve our product speci?cations or transact the approval sheet for product speci?cations before ordering.
! Caution/Notice
c Notice (Soldering and Mounting) PRG15 Series
1. Solder and Flux
R90E.pdf
Mar.4,2014
(1) Solder Paste
Use solder paste Sn:Pb=63:37wt%.
For your reference, we are using
63Sn/37Pb RMA9086 90-3-M18,
manufactured by Alpha Metals Japan Ltd.
96.5Sn/3.0Ag/0.5Cu M705-GRN360-K2-V,
manufactured by Senju Metal Industry Co., LTD for any
(2) Flux
Use rosin type flux in soldering process.
If below flux is used, some problems might be caused
in the product characteristics and reliability.
Please do not use below flux.
0.2wt%).
Internal tests of this product.
(*Water-soluble flux can be defined as non rosin type
flux including wash-type flux and non-wash-type flux.)
2. Cleaning Conditions and Drying
To remove the flux after soldering, observe the following
points in order to avoid deterioration of the characteristics
or any change to the external electrodes quality.
(1) Cleaning Conditions
Solvent
2-propanol
Dipping Cleaning
Less than 5 minutes
at room temp.
or
Less than 2 minutes
at 40?C max.
Ultrasonic Cleaning
Less than 1 minute
20W/L Frequency
of several 10kHz
to 100kHz.
A sufficient cleaning should be applied to remove flux completely.
(2) Drying
After cleaning, promptly dry this product.
3. Soldering Conditions
In your mounting process, observe the following points in
order to avoid deterioration of the characteristics or
destruction of this product. The mounting quality of this
product may also be affected by the mounting conditions,
shown in the points below.
This product is for reflow soldering only. Flow soldering
should not be allowed.
(1) Printing Conditions of Solder Paste
(a) Standard thickness of solder paste printing should
be from 0.10 to 0.15 mm.
(b) After soldering, the solder fillet should be a height
from 0.15 mm to the thickness of this product (see the
figure at right).
(c) Too much solder gives too strong mechanical stress
to this product. Such stress may cause cracking or
E
Electrode
Solder
T
Solder
0.15mm V T V E
other mechanical damage. Also, it can destroy the
electrical performance of this product.
Continued on the following page.
88
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