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参数资料
| 型号： | PRF21BE471QB5RA |
| 厂商： | Murata Electronics North America |
| 文件页数： | 99/105页 |
| 文件大小： | 0K |
| 描述： | THERMISTOR |
| 标准包装： | 4,000 |
| 系列： | PRF18/21 |
| 在 25°C 时的电阻（欧姆）： | 470 |
| 电阻公差： | ±50% |
| 工作温度： | -20°C ~ 100°C |
| 安装类型： | PCB，表面贴装 |
| 封装/外壳： | 芯片 |
| 供应商设备封装： | * |
| 包装： | * |
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! Note ? Please read rating and ! CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
? This catalog has only typical speci?cations. Therefore, please approve our product speci?cations or transact the approval sheet for product speci?cations before ordering.
R90E.pdf
Mar.4,2014
! Caution/Notice
Continued from the preceding page.
(2) Adhesive Application and Curing
(a) If insufficient adhesive is applied, or if the adhesive
is not sufficiently hardened, this product may have a
loose contact with the land, during flow soldering.
(b) Too low viscosity of adhesive causes this product to
slip on the board, after mounting.
Allowable Flow Soldering Temp. and Time
270
260
250
240
230
220
210
(3) Allowable Soldering Temperature and Time
(a) Solder within the temperature and time
combinations, indicated by the slanted lines in the
following graphs.
(b) Excessive soldering conditions may cause
dissolution of metallization or deterioration of
solder-wetting on the external electrode.
(c) In the case of repeated soldering, the accumulated
soldering time should be within the range shown in
the figures below. (For example, Reflow peak
temperature: 260°C, twice –> The accumulated
soldering time at 260°C is within 30sec.)
Allowable Reflow Soldering Temp. and Time
280
270
260
250
240
230
220
200
0
10 20
Time (sec.)
30
210
0 10 20 30 40 50 60 70 80 90 100 110
Time (sec.)
(4) Recommendable Temperature Profile for Soldering
(a) Insufficient preheating may cause a crack on the
ceramic body. The difference between preheating
temperature and maximum temperature in the profile
should be 100°C.
(b) Rapid cooling by dipping in solvent or by other
means is not recommended.
Flow Soldering Conditions
Reflow Soldering Conditions
Preheating (in air)
Soldering
Gradual cooling
(in air)
Preheating (in air)
Soldering
Gradual cooling
(in air)
200
100
0
250°C
200
100
0
250°C
1 to 2 min.
*3 sec.
1 to 2 min.
*20 sec.
Preheating: 150±10°C, 1-2 minutes.
Soldering: 250°C, 3 sec.
* In the case of repeated soldering, the accumulated soldering
time should be within the range shown in "(3) Allowable
Soldering Temperature and Time."
Preheating: 150±10°C, 1-2 minutes.
Soldering: 250°C, 20 sec.
* In the case of repeated soldering, the accumulated soldering
time should be within the range shown in "(3) Allowable
Soldering Temperature and Time."
(5) There may be a risk of unexpected failures
(tombstone, insufficient solder-wetting, etc.) in the
mounting process caused by mounting conditions.
Please make sure that this product is correctly mounted
under the specified mounting conditions.
97
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