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| 型号： | PRF21BE471QB5RA |
| 厂商： | Murata Electronics North America |
| 文件页数： | 83/105页 |
| 文件大小： | 0K |
| 描述： | THERMISTOR |
| 标准包装： | 4,000 |
| 系列： | PRF18/21 |
| 在 25°C 时的电阻（欧姆）： | 470 |
| 电阻公差： | ±50% |
| 工作温度： | -20°C ~ 100°C |
| 安装类型： | PCB，表面贴装 |
| 封装/外壳： | 芯片 |
| 供应商设备封装： | * |
| 包装： | * |
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! Note ? Please read rating and ! CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
? This catalog has only typical speci?cations. Therefore, please approve our product speci?cations or transact the approval sheet for product speci?cations before ordering.
R90E.pdf
Mar.4,2014
Overheat Sensing Chip Type Speci?cations and Test Methods
c PRF18/21_471Q Series
No.
Item
Rating Value
Metheod of Examination
After applying maximum operating voltage for 3 mins. and
1
Resistance Value at 25°C
Within the specified range
leaving for 2 hours in 25°C, measured by applying voltage less
than DC1.5V. (by a direct current less than 10mA)
Reference standard: IEC 60068-2-21 (2006)
2
Adhesive Strength
There is no sign of exfoliation on electrode.
· Soldered PTC to PCB (**)
· Force: 5.0N
· Test time: 10 sec.
Reference standard: IEC 60068-2-6 (2007)
· Soldered PTC to PCB (**)
3
Vibration
· Appearance: No defects or abnormalities
· Resistance (R25) change: Less than ±20% (*)
· Frequency range: 10 to 55Hz
· Amplitude: 1.5mm
· Sweep rate: 1 octave/min.
· Direction: X-Y-Z (3 direction)
· 24 cycles in each axis
Reference standard: IEC 60068-2-58 (2004)
4
Solderability
Wetting of soldering area: U 95%
· Solder: Sn-3.0Ag-0.5Cu
· Solder temp.: 245±5°C
· Immersion time: 3±0.3s
Reference standard: IEC 60068-2-58 (2004)
[ Solder bath method ]
5
Resistance to Soldering Heat
· Appearance: No defects or abnormalities
· Resistance (R25) change: Less than ±20% (*)
· Solder: Sn-3.0Ag-0.5Cu
· Preheat: 150±5°C, 90 to 120s
· Solder temp.: 260±5°C
· Immersion time: 10±1s
Reference standard: IEC 60068-2-2 (2007)
6
7
8
9
High Temperature Storage
Low Temperature Storage
Damp Heat, Steady State
Thermal Shock
· Appearance: No defects or abnormalities
· Resistance (R25) change: Less than ±20% (*)
· Soldered PTC to PCB (**)
· +150±2°C
· 1000+48/-0 hrs.
Reference standard: IEC 60068-2-1 (2007)
· Soldered PTC to PCB (**)
· -20±3°C
· 1000+48/-0 hrs
Reference standard: IEC 60068-2-67 (1995)
· Soldered PTC to PCB (**)
· +40±2°C, 90±5%RH
· 500+24/-0 hrs
Reference standard: IEC 60068-2-14 (2009)
[ Test Na ]
· Soldered PTC to PCB (**)
· Transport time: <10 sec.
· Test condition: See below table
Step
1
2
Condition
-20±3°C
+150±2°C
Time
30min.
30min.
· Test cycle: 5 cycles
Reference standard: IEC 60068-2-2 (2007)
· Soldered PTC to PCB (**)
10 High Temperature Load
· +85±2°C
· Applied max. voltage
· 1000+48/-0 hrs.
*: The resistance value after the test. It is measured by applying voltage less than DC1.5V (by a direct current less than 10mA) after left at 25±2°C for 2hrs.
**: Above mentioned soldering is done under the following conditions at our side.
· Glass-Epoxy PC board
· Standard land dimension
· Standard solder paste
· Standard solder profile
Above conditions are mentioned in Notice.
81
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