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| 型号： | PTN3392BS/FX |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 模拟信号调理 |
| 英文描述： | SPECIALTY ANALOG CIRCUIT, PQCC48 |
| 封装： | 7 X 7 MM, 0.85 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, PLASTIC, MO-220, SOT619-1, HVQFN-48 |
| 文件页数： | 17/29页 |
| 文件大小： | 641K |
| 代理商： | PTN3392BS/FX |
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PTN3392
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 2 — 15 July 2010
24 of 29
NXP Semiconductors
PTN3392
2-lane DisplayPort to VGA adapter IC
14.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 9) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 16 and 17
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 9.
Table 16.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 17.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相关代理商/技术参数 |
参数描述 |
|---|---|
| PTN3393BS/F1Y | 制造商:NXP Semiconductors 功能描述:PTN3393BS/HVQFN40/REEL13DP//F1 - Tape and Reel 制造商:NXP Semiconductors 功能描述:IC DISPLAYPORT TO VGA 40HVQFN |
| PTN3393BSY | 制造商:NXP Semiconductors 功能描述:PTN3393BS/HVQFN40/REEL13DP// - Tape and Reel 制造商:NXP Semiconductors 功能描述:IC DISPLAYPORT TO VGA 40HVQFN 制造商:NXP Semiconductors 功能描述:INTERFACE PRODUCTS |
| PTN3460BS,518 | 功能描述:接口 - 专用 PTN3460BS, HVQFN56, REEL13DP RoHS:否 制造商:Texas Instruments 产品类型:1080p60 Image Sensor Receiver 工作电源电压:1.8 V 电源电流:89 mA 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:BGA-59 |
| PTN3460BS/F1,518 | 功能描述:接口 - 专用 DisplayPort to LVDS bridge IC RoHS:否 制造商:Texas Instruments 产品类型:1080p60 Image Sensor Receiver 工作电源电压:1.8 V 电源电流:89 mA 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:BGA-59 |
| PTN3460BS/F2,518 | 功能描述:显示接口集成电路 PTN3460BS HVQFN56 REEL13DP F2 RoHS:否 制造商:Texas Instruments 电源电流:125 mA 工作温度范围:- 40 C to + 105 C 封装 / 箱体:WQFN-60 封装:Reel |
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