参数资料
型号: R5F21272SNFP
元件分类: 微控制器/微处理器
英文描述: 16-BIT, FLASH, 20 MHz, MICROCONTROLLER, PQFP32
封装: 7 X 7 MM, 0.80 MM PITCH, PLASTIC, LQFP-32
文件页数: 17/52页
文件大小: 620K
代理商: R5F21272SNFP
41
ATmega165A/PA/325A/PA/3250A/PA/645A/P/6450A/P [DATASHEET]
8285E–AVR–02/2013
10.11 Register description
10.11.1
SMCR – Sleep Mode Control Register
The Sleep Mode Control Register contains control bits for power management.
Bits 3, 2, 1 – SM2:0: Sleep Mode Select Bits 2, 1, and 0
These bits select between the five available sleep modes as shown in Table 10-2.
Note:
1. Standby mode is only recommended for use with external XTALs or resonators.
Bit 0 – SE: Sleep Enable
The SE bit must be written to logic one to make the MCU enter the sleep mode when the SLEEP instruction is exe-
cuted. To avoid the MCU entering the sleep mode unless it is the programmer’s purpose, it is recommended to
write the Sleep Enable (SE) bit to one just before the execution of the SLEEP instruction and to clear it immediately
after waking up.
10.11.2
MCUCR – MCU Control Register
Note:
1. Only available in the Atmel ATmega165PA/325PA/3250PA/645P/6450P picoPower devices.
Bit 6 – BODS: BOD Sleep
The BODS bit must be written to logic one in order to turn off BOD during sleep, see Table 10-1 on page 37. Writ-
ing to the BODS bit is controlled by a timed sequence and an enable bit, BODSE in MCUCR. To disable BOD in
relevant sleep modes, both BODS and BODSE must first be set to one. Then, to set the BODS bit, BODS must be
set to one and BODSE must be set to zero within four clock cycles.
The BODS bit is active three clock cycles after it is set. A sleep instruction must be executed while BODS is active
in order to turn off the BOD for the actual sleep mode. The BODS bit is automatically cleared after three clock
cycles.
Bit
765
432
10
0x33 (0x53)
SM2
SM1
SM0
SE
SMCR
Read/Write
RR
R/W
Initial Value
000
00
Table 10-2.
Sleep mode select.
SM2
SM1
SM0
Sleep mode
00
0
Idle
0
1
ADC Noise Reduction
0
1
0
Power-down
01
1
Power-save
1
0
Reserved
1
0
1
Reserved
1
0
Standby (1)
1
Reserved
Bit
7
6
5
4
3
2
1
0
0x35 (0x55)
JTD
BODS
BODSE
PUD
IVSEL
IVCE
MCUCR
Read/Write
R/W
RR
R/W
Initial Value
0
相关PDF资料
PDF描述
R5F21264KXXXFP 16-BIT, FLASH, 20 MHz, MICROCONTROLLER, PQFP32
R5F21264JFP 16-BIT, FLASH, 20 MHz, MICROCONTROLLER, PQFP32
R5F21276SDXXXFP 16-BIT, FLASH, 20 MHz, MICROCONTROLLER, PQFP32
R5F21276KFP 16-BIT, FLASH, 20 MHz, MICROCONTROLLER, PQFP32
R5F21274SDFP 16-BIT, FLASH, 20 MHz, MICROCONTROLLER, PQFP32
相关代理商/技术参数
参数描述
R5F21272SNFP#U0 制造商:Renesas Electronics Corporation 功能描述:MCU 16-Bit R8C CISC 8KB Flash 3.3V/5V 32-Pin LQFP Tray 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT R8C CISC 8KB FLASH 3.3V/5V 32LQFP - Trays 制造商:Renesas Electronics Corporation 功能描述:IC R8C/27 MCU FLASH 32LQFP
R5F21272SNFP#V0 功能描述:IC R8C/27 MCU FLASH 32LQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器, 系列:R8C/2x/27 标准包装:250 系列:80C 核心处理器:8051 芯体尺寸:8-位 速度:16MHz 连通性:EBI/EMI,I²C,UART/USART 外围设备:POR,PWM,WDT 输入/输出数:40 程序存储器容量:- 程序存储器类型:ROMless EEPROM 大小:- RAM 容量:256 x 8 电压 - 电源 (Vcc/Vdd):4.5 V ~ 5.5 V 数据转换器:A/D 8x10b 振荡器型:内部 工作温度:-40°C ~ 85°C 封装/外壳:68-LCC(J 形引线) 包装:带卷 (TR)
R5F21272SNFP#V2 功能描述:MCU 8KB ROM 512B RAM 32-LQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器, 系列:R8C/2x/27 标准包装:250 系列:80C 核心处理器:8051 芯体尺寸:8-位 速度:16MHz 连通性:EBI/EMI,I²C,UART/USART 外围设备:POR,PWM,WDT 输入/输出数:40 程序存储器容量:- 程序存储器类型:ROMless EEPROM 大小:- RAM 容量:256 x 8 电压 - 电源 (Vcc/Vdd):4.5 V ~ 5.5 V 数据转换器:A/D 8x10b 振荡器型:内部 工作温度:-40°C ~ 85°C 封装/外壳:68-LCC(J 形引线) 包装:带卷 (TR)
R5F21272SNFP#W4 制造商:Renesas Electronics Corporation 功能描述:MCU 3/5V 8+2K PB-FREE 32-LQFP T&R - Tape and Reel
R5F21272SNFP#X6 功能描述:MCU 8KB ROM 512B RAM 32-LQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器, 系列:R8C/2x/27 标准包装:300 系列:78K0R/Ix3 核心处理器:78K/0R 芯体尺寸:16-位 速度:40MHz 连通性:3 线 SIO,I²C,LIN,UART/USART 外围设备:DMA,LVD,POR,PWM,WDT 输入/输出数:27 程序存储器容量:16KB(16K x 8) 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:1K x 8 电压 - 电源 (Vcc/Vdd):2.7 V ~ 5.5 V 数据转换器:A/D 8x10b 振荡器型:内部 工作温度:-40°C ~ 85°C 封装/外壳:38-SSOP 包装:托盘