参数资料
型号: R5F56217BDLE#U0
厂商: Renesas Electronics America
文件页数: 45/148页
文件大小: 0K
描述: MCU 32BIT FLASH 384KROM 145TFLGA
产品培训模块: RX Compare Match Timer
RX DMAC
标准包装: 1
系列: RX600
核心处理器: RX
芯体尺寸: 32-位
速度: 100MHz
连通性: CAN,EBI/EMI,I²C,SCI,SPI,USB
外围设备: DMA,LVD,POR,PWM,WDT
输入/输出数: 103
程序存储器容量: 384KB(384K x 8)
程序存储器类型: 闪存
RAM 容量: 64K x 8
电压 - 电源 (Vcc/Vdd): 2.7 V ~ 3.6 V
数据转换器: A/D 8x10/12b,D/A 2x10b
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: 145-TFLGA
包装: 托盘
2004 Microchip Technology Inc.
DS39609B-page 137
PIC18F6520/8520/6620/8620/6720/8720
12.2
Timer1 Oscillator
A crystal oscillator circuit is built-in between pins T1OSI
(input) and T1OSO (amplifier output). It is enabled by
setting control bit, T1OSCEN (T1CON<3>). The oscil-
lator is a low-power oscillator, rated up to 200 kHz. It
will continue to run during Sleep. It is primarily intended
for a 32 kHz crystal. The circuit for a typical LP oscilla-
tor is shown in Figure 12-3. Table 12-1 shows the
capacitor selection for the Timer1 oscillator.
The user must provide a software time delay to ensure
proper start-up of the Timer1 oscillator
FIGURE 12-3:
EXTERNAL
COMPONENTS FOR THE
TIMER1 LP OSCILLATOR
12.2.1
LOW-POWER TIMER1 OPTION
(PIC18FX520 DEVICES ONLY)
The Timer1 oscillator for PIC18LFX520 devices incor-
porates a low-power feature, which allows the oscillator
to automatically reduce its power consumption when
the microcontroller is in Sleep mode.
As high noise environments may cause excessive
oscillator instability in Sleep mode, this option is best
suited for low
noise applications
where power
conservation is an important design consideration. Due
to the low-power nature of the oscillator, it may also be
sensitive to rapidly changing signals in close proximity.
The oscillator circuit, shown in Figure 12-3, should be
located as close as possible to the microcontroller.
There should be no circuits passing within the oscillator
circuit boundaries other than VSS or VDD.
If a high-speed circuit must be located near the oscilla-
tor (such as the CCP1 pin in output compare or PWM
mode, or the primary oscillator using the OSC2 pin), a
grounded guard ring around the oscillator circuit, as
shown in Figure 12-4, may be helpful when used on a
single-sided PCB or in addition to a ground plane.
FIGURE 12-4:
OSCILLATOR CIRCUIT
WITH GROUNDED
GUARD RING
TABLE 12-1:
CAPACITOR SELECTION
FOR THE ALTERNATE
OSCILLATOR
Osc Type
Freq
C1
C2
LP
32 kHz
TBD(1)
Crystal to be Tested:
32.768 kHz
Epson C-001R32.768K-A
± 20 PPM
Note 1: Microchip suggests 33 pF as a starting
point in validating the oscillator circuit.
2: Higher capacitance increases the stability
of the oscillator, but also increases the
start-up time.
3: Since each resonator/crystal has its own
characteristics, the user should consult
the resonator/crystal manufacturer for
appropriate
values
of
external
components.
4: Capacitor values are for design guidance
only.
Note:
See the Notes with Table 12-1 for additional
information about capacitor selection.
C1
C2
XTAL
PIC18FXX20
T1OSI
T1OSO
32.768 kHz
33 pF
Note:
PIC18FX620/X720
devices
have
the
standard Timer1 oscillator permanently
selected.
PIC18LFX620/X720
devices
have the low-power Timer1 oscillator
permanently selected.
VDD
OSC1
VSS
OSC2
RC0
RC1
RC2
Note:
Not drawn to scale.
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