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参数资料
| 型号： | RB80526PY500256 |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 500 MHz, MICROPROCESSOR, CPGA370 |
| 封装： | FCPGA-370 |
| 文件页数： | 37/80页 |
| 文件大小： | 569K |
| 代理商： | RB80526PY500256 |
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42
Datasheet
Pentium III Processor for the PGA370 Socket at 500 MHz to 1 GHz
that just meets the pulse duration for a specific magnitude where the AF < 1, means that there can
be NO other overshoot/undershoot events, even of lesser magnitude (note that if AF = 1, then the
event occurs at all times and no other events can occur).
Note:
Activity factor for AGTL+ signals is referenced to BCLK frequency.
Note:
Activity factor for CMOS signals is referenced to PICCLK frequency.
3.3.5
Reading Overshoot/Undershoot Specification Tables
The overshoot/undershoot specification for the Pentium III processor for the PGA370 socket is not
a simple single value. Instead, many factors are needed to determine what the over/undershoot
specification is. In addition to the magnitude of the overshoot, the following parameters must also
be known: the junction temperature the processor will be operating at, the width of the overshoot
(as measured above 1.635V) and the Activity Factor (AF). To determine the allowed overshoot for
a particular overshoot event, the following must be done:
1. Determine the signal group that particular signal falls into. If the signal is an AGTL+ signal
operating with a 100 MHz system bus, use Table 20 (100MHz AGTL+ signal group). If the
signal is an AGTL+ signal operating with a 133MHz system bus, use Table 21 (133 MHz
AGTL+ signal group). If the signal is a CMOS signal, use Table 22 (33 MHz CMOS signal
group).
2. Determine the maximum junction temperature (Tj) for the range of processors that the system
will support (80oC or 85oC).
3. Determine the Magnitude of the overshoot (relative to VSS)
4. Determine the Activity Factor (how often does this overshoot occur?)
5. From the appropriate Specification table, read off the Maximum Pulse Duration (in ns)
allowed.
6. Compare the specified Maximum Pulse Duration to the signal being measured. If the Pulse
Duration measured is less than the Pulse Duration shown in the table, then the signal meets the
specifications.
The above procedure is similar for undershoots after the undershoot waveform has been converted
to look like an overshoot. Undershoot events must be analyzed separately from Overshoot events
as they are mutually exclusive.
Below is an example showing how the maximum pulse duration is determined for a given
waveform.
NOTES:
1. Corresponding Maximum Puse Duration Specification - 2.4 ns
2. Pulse Duration (measured) - 2.0 ns
Given the above parameters, and using Table 21 (85
oC/AF = 0.1 column) the maximum allowed
pulse duration is 2.4 ns. Since the measure pulse duration is 2.0 ns, this particular overshoot event
passes the overshoot specifications, although this doesn't guarantee that the combined overshoot/
undershoot events meet the specifications.
Table 19. Example Platform Information
Required Information
Maximum Platform Support
Notes
FSB Signal Group
133 MHz AGTL+
Max Tj
85 °C
Overshoot Magnitude
2.13V
Measured Value
Activity Factor (AF)
0.1
Measured overshoot occurs on
average every 20 clocks
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相关代理商/技术参数 |
参数描述 |
|---|---|
| RB80526PY600256 | 制造商:Intel 功能描述:MPU Pentium 制造商:Rochester Electronics LLC 功能描述:PENTIUM-III 0.18 MICRON 600MHZ 3.3V 370-PIN FCPGA - Bulk |
| RB80526PY600256S L5BT | 功能描述:IC PENTIUM III 600MHZ FC-PGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:- 标准包装:2 系列:MPC8xx 处理器类型:32-位 MPC8xx PowerQUICC 特点:- 速度:133MHz 电压:3.3V 安装类型:表面贴装 封装/外壳:357-BBGA 供应商设备封装:357-PBGA（25x25） 包装:托盘 |
| RB80526PY600256SL5BT | 制造商:Intel 功能描述:MPU Pentium 制造商:Intel 功能描述:MPU Pentium? III Processor 64-Bit 0.18um 600MHz 370-Pin FCPGA |
| RB80526PY700256 | 制造商:Intel 功能描述:MPU Pentium? III Processor 64-Bit 0.18um 700MHz 370-Pin FCPGA 制造商:Rochester Electronics LLC 功能描述:PIII 700/100 256K ON DIE FC-PGA - Bulk |
| RB80526PY700256S L4ZM | 功能描述:IC PENTIUM III 700MHZ FC-PGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:- 标准包装:2 系列:MPC8xx 处理器类型:32-位 MPC8xx PowerQUICC 特点:- 速度:133MHz 电压:3.3V 安装类型:表面贴装 封装/外壳:357-BBGA 供应商设备封装:357-PBGA（25x25） 包装:托盘 |
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