参数资料
型号: RB80526PY500256
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 500 MHz, MICROPROCESSOR, CPGA370
封装: FCPGA-370
文件页数: 62/80页
文件大小: 569K
代理商: RB80526PY500256
Datasheet
65
Pentium III Processor for the PGA370 Socket at 500 MHz to 1 GHz
The fan heatsink is designed to allow visibility of the FC-PGA processor markings located on top
of the package. The FC-PGA processor markings are visible after installation of the fan heatsink
due to notched sides of the heatsink base (specified in Figure 27). The boxed processor fan heatsink
is also asymmetrical in that the mechanical step feature (specified in Figure 26) must sit over the
socket’s cam. The step allows the heatsink to securely interface with the processor in order to meet
thermal requirements.
Note: The heatsink airflow keepout zones found in Table 31 and Figure 29 refer specifically to the
boxed processor’s active fan heatsink. This does not reflect the worst-case dimensions that may
exist with other third party passive or active fan heatsinks.
Figure 23. Space Requirements for the Boxed Processor to 850MHz
Figure 24. Space Requirements for the Boxed Processor from 866 to 933MHz
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