参数资料
型号: RCPXA272FC0520
厂商: MARVELL SEMICONDUCTOR INC
元件分类: 微控制器/微处理器
英文描述: 520 MHz, MICROPROCESSOR, PBGA336
封装: 14 X 14 MM, 1.55 MM HEIGHT, 0.65 MM PITCH, LEAD FREE, CSP-336
文件页数: 64/138页
文件大小: 1048K
代理商: RCPXA272FC0520
Part 1: EMTS
Ballout and Signal Descriptions
Intel PXA27x Processor Family Memory Subsystem
31
4.2
Signal Descriptions
Table 4 describes the active signals for the PXA27x processor memory subsystem.
Table 4.
Intel PXA27x Processor Memory Subsystem Signal Descriptions (Sheet 1 of 3)
Symbol
Type
Name and Function
A[MAX:MIN]
Input
ADDRESS: Global device signals. Share inputs for all memory die addresses during read and write
operations.
For 16-bit bus operations, A[24:1] signal balls are used, while 32-bit bus operations, A[25:2] are used.
This is due to the PXA27x processor addresses shift as compare to the flash and LPSDRAM die.
Flash die addressability: A[23:0] for 256-Mbit die; A[22:0] for 128-Mbit die.
For 256-Mbit LPSDRAM die: A[13:1] are the row and A[9:1] are the column addresses.
LPSDRAM Address inputs also provide the op-code during a Mode Register Set or Special Mode
Register Set command.
A11 defines the Auto Precharge. During a LPSDRAM Precharge command, A11 is sampled to
determine if all banks are to be precharged (A11 = HIGH).
DQ[MAX:0]
Input/
Output
DATA INPUT/OUTPUTS: Global device signals. Inputs data and commands during write cycles,
outputs data during read cycles. Data signals float when the device or its output are deselected. Data
are internally latched during writes on the device.
DQ[15:0] are used for 16-bit bus operations.
DQ[31:0] are used for 32-bit bus operations.
ADV#
Input
ADDRESS VALID: Low-true input.
During synchronous flash read operations, addresses are latched on the rising edge of ADV#, or on
the next valid F-CLK edge, whichever occurs first.
In asynchronous flash read operation, addresses are latched on the rising edge ADV#, or are
continuously flow-through when ADV# is kept asserted.
F-CE#
Input
FLASH CHIP ENABLE: Low-true input.
F-CE# low selects the associated flash memory die. F-CE# high deselects the associated flash die.
When deasserted, the associated flash die is deselected, power is reduced to standby levels, data
outputs are placed in high-Z state.
F-CLK,
R-CLK
Input
CLOCK: Synchronizes the selected memory die to the PXA27x memory bus clock in synchronous
operations.
F-CLK is a flash signal. Synchronizes the flash die to the PXA27x memory bus frequency in
synchronous operations.
R-CLK is a LPSDRAM input signal. Synchronizes the LPSDRAM die to the PXA27x memory bus
clock. LPSDRAM is sampled on the positive edge of R-CLK. R-CLK also increments the internal
burst counter and controls the output registers.
OE#
Input
OUTPUT ENABLE: Low-true input.
OE# low enables the output drivers of the selected flash die. OE# high places the flash output drivers
of the selected die in high-Z.
F-RST#
Input
FLASH RESET: Low-true input.
F-RST# low resets internal operations and inhibits write operations. F-RST# high enables normal
operation. Exit from reset places the flash device in asynchronous read array mode.
WAIT
Output
DEVICE WAIT: Flash die configurable Low-True or High-True output.
Indicates data is valid in synchronous array or non-array sync flash reads. Configuration Register bit
10 (CR.10, WT) determines its polarity when asserted. With F-CE# and OE# at VIL, WAIT’s active
output is VOL or VOH. WAIT is high-Z if F-CE# or OE# is VIH.
In synchronous array or non-array flash read modes, WAIT indicates invalid data when asserted
and valid data when deasserted.
In asynchronous flash page read, and all flash write modes, WAIT is deasserted.
相关PDF资料
PDF描述
RCPXA273FC0416 416 MHz, MICROPROCESSOR, PBGA336
RCPXA273FC0520 520 MHz, MICROPROCESSOR, PBGA336
RCPXA272FC0312 312 MHz, MICROPROCESSOR, PBGA336
RCPXA271FC0312 312 MHz, MICROPROCESSOR, PBGA336
RCPXA271FC0416 416 MHz, MICROPROCESSOR, PBGA336
相关代理商/技术参数
参数描述
RCQ50110S05 功能描述:DC-DC CONV, RAILWAY, 50W 制造商:xp power 系列:RCQ 包装:散装 零件状态:有效 类型:隔离模块 输出数:1 电压 - 输入(最小值):66V 电压 - 输入(最大值):160V 电压 - 输出 1:5V 电压 - 输出 2:- 电压 - 输出 3:- 电流 - 输出(最大值):10A 功率(W) - 制造系列:50W 电压 - 隔离:3kV(3000V) 应用:ITE(商业),铁路 特性:远程开/关 安装类型:通孔 封装/外壳:8-DIP 模块 大小/尺寸:2.28" 长 x 1.45" 宽 x 0.50" 高(57.9mm x 36.8mm x 12.7mm) 工作温度:-40°C ~ 35°C 效率:90% 功率(W) - 最大值:50W 标准包装:1
RCQ50110S12 功能描述:DC-DC CONV, RAILWAY, 50W 制造商:xp power 系列:RCQ 包装:散装 零件状态:有效 类型:隔离模块 输出数:1 电压 - 输入(最小值):66V 电压 - 输入(最大值):160V 电压 - 输出 1:12V 电压 - 输出 2:- 电压 - 输出 3:- 电流 - 输出(最大值):4.17A 功率(W) - 制造系列:50W 电压 - 隔离:3kV(3000V) 应用:ITE(商业),铁路 特性:远程开/关 安装类型:通孔 封装/外壳:8-DIP 模块 大小/尺寸:2.28" 长 x 1.45" 宽 x 0.50" 高(57.9mm x 36.8mm x 12.7mm) 工作温度:-40°C ~ 35°C 效率:91% 功率(W) - 最大值:50W 标准包装:1
RCQ50110S15 功能描述:DC-DC CONV, RAILWAY, 50W 制造商:xp power 系列:RCQ 包装:散装 零件状态:有效 类型:隔离模块 输出数:1 电压 - 输入(最小值):66V 电压 - 输入(最大值):160V 电压 - 输出 1:15V 电压 - 输出 2:- 电压 - 输出 3:- 电流 - 输出(最大值):3.33A 功率(W) - 制造系列:50W 电压 - 隔离:3kV(3000V) 应用:ITE(商业),铁路 特性:远程开/关 安装类型:通孔 封装/外壳:8-DIP 模块 大小/尺寸:2.28" 长 x 1.45" 宽 x 0.50" 高(57.9mm x 36.8mm x 12.7mm) 工作温度:-40°C ~ 35°C 效率:92% 功率(W) - 最大值:50W 标准包装:1
RCQ50110S24 功能描述:DC-DC CONV, RAILWAY, 50W 制造商:xp power 系列:RCQ 包装:散装 零件状态:有效 类型:隔离模块 输出数:1 电压 - 输入(最小值):66V 电压 - 输入(最大值):160V 电压 - 输出 1:24V 电压 - 输出 2:- 电压 - 输出 3:- 电流 - 输出(最大值):2.08A 功率(W) - 制造系列:50W 电压 - 隔离:3kV(3000V) 应用:ITE(商业),铁路 特性:远程开/关 安装类型:通孔 封装/外壳:8-DIP 模块 大小/尺寸:2.28" 长 x 1.45" 宽 x 0.50" 高(57.9mm x 36.8mm x 12.7mm) 工作温度:-40°C ~ 35°C 效率:91% 功率(W) - 最大值:50W 标准包装:1
RCQ5072S05 功能描述:DC-DC CONV, RAILWAY, 50W 制造商:xp power 系列:RCQ 包装:散装 零件状态:有效 类型:隔离模块 输出数:1 电压 - 输入(最小值):43V 电压 - 输入(最大值):101V 电压 - 输出 1:5V 电压 - 输出 2:- 电压 - 输出 3:- 电流 - 输出(最大值):10A 功率(W) - 制造系列:50W 电压 - 隔离:3kV(3000V) 应用:ITE(商业),铁路 特性:远程开/关 安装类型:通孔 封装/外壳:8-DIP 模块 大小/尺寸:2.28" 长 x 1.45" 宽 x 0.50" 高(57.9mm x 36.8mm x 12.7mm) 工作温度:-40°C ~ 35°C 效率:90% 功率(W) - 最大值:50W 标准包装:1