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参数资料
| 型号： | RK80532EC056512 |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 2400 MHz, MICROPROCESSOR, CPGA604 |
| 封装： | FLIP CHIP, MICRO PGA-604 |
| 文件页数： | 8/102页 |
| 文件大小： | 2349K |
| 代理商： | RK80532EC056512 |
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Low Voltage Intel Xeon Processor at 1.60 GHz, 2.0 GHz and 2.4 GHz
Datasheet
13
2.0
Electrical Specifications
2.1
System Bus and GTLREF
Most Low Voltage Intel
Xeon processor system bus signals use Assisted Gunning Transceiver
Logic (AGTL+) signaling technology. This signaling technology provides improved noise margins
and reduced ringing through low voltage swings and controlled edge rates. The processor
termination voltage level is V
CC, the operating voltage of the processor core. The use of a
termination voltage that is determined by the processor core allows better voltage scaling on the
processor system bus. Because of the speed improvements to data and address busses, signal
integrity and platform design methods become more critical than with previous processor families.
The AGTL+ inputs require a reference voltage (GTLREF) that is used by the receivers to determine
if a signal is a logical 0 or a logical 1. GTLREF must be generated on the baseboard (See Table 12
for GTLREF specifications). Termination resistors are provided on the processor silicon and are
terminated to its core voltage (VCC). The on-die termination resistors are a selectable feature and
may be enabled or disabled through the ODTEN pin. For end bus agents, on-die termination may
be enabled to control reflections on the transmission line. For middle bus agents, on-die
termination must be disabled. Intel chipsets may also provide on-die termination, thus eliminating
the need to terminate the bus on the baseboard for most AGTL+ signals. Refer to Section 2.12 for
details on ODTEN resistor termination requirements.
Some AGTL+ signals do not include on-die termination and must be terminated on the baseboard.
See Table 5 for details regarding these signals.
The AGTL+ signals depend on incident wave switching. Therefore timing calculations for AGTL+
signals are based on flight time as opposed to capacitive deratings. Analog signal simulation of the
system bus, including trace lengths, is highly recommended when designing a system.
2.2
Power and Ground Pins
For clean on-chip power distribution, the Low Voltage Intel Xeon processor has 190 VCC (power)
and 189 VSS (ground) inputs. All VCC pins must be connected to the system power plane, while all
VSS pins must be connected to the system ground plane. The processor VCC pins must be supplied
the voltage determined by the processor VID (Voltage ID) pins.
2.3
Decoupling Guidelines
Due to its large number of transistors and high internal clock speeds, the processor is capable of
generating large average current swings between low and full power states. This may cause
voltages on power planes to sag below their minimum values when bulk decoupling is not
adequate. Larger bulk storage (CBULK), such as electrolytic capacitors, supply current during longer
lasting changes in current demand by the component, such as coming out of an idle condition.
Similarly, they act as a storage well for current when entering an idle condition from a running
condition. Care must be taken in the baseboard design to ensure that the voltage provided to the
processor remains within the specifications listed in Table 7. Failure to do so may result in timing
violations or reduced lifetime of the component. For further information and guidelines, refer to the
appropriate platform design guidelines.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| RK80532EE056512 SL74T | 制造商:Intel 功能描述: |
| RK80532EE056512S L74T | 制造商:Intel 功能描述:MPU Xeon? Processor 64-Bit 0.13um 2.4GHz 604-Pin FCmPGA2 制造商:Intel 功能描述:PRESTONIA; MPU XEON NETBURST 64BIT 0.13UM 2.4GHZ 604PIN - Trays |
| RK80532EE056512SL74T | 功能描述:IC XEON LV 2.4GHZ 604FC-MPGA-2P RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:- 标准包装:2 系列:MPC8xx 处理器类型:32-位 MPC8xx PowerQUICC 特点:- 速度:133MHz 电压:3.3V 安装类型:表面贴装 封装/外壳:357-BBGA 供应商设备封装:357-PBGA（25x25） 包装:托盘 |
| RK80532KE056512 | 制造商:Intel 功能描述:OVERLAND DATA BOND - Trays 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| RK80532KE056512S L6GD | 功能描述:IC XEON 2.4GHZ INT-MPGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:- 标准包装:2 系列:MPC8xx 处理器类型:32-位 MPC8xx PowerQUICC 特点:- 速度:133MHz 电压:3.3V 安装类型:表面贴装 封装/外壳:357-BBGA 供应商设备封装:357-PBGA（25x25） 包装:托盘 |
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