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参数资料
| 型号： | RM100355WFQMLV |
| 厂商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分类： | 锁存器 |
| 英文描述： | 100K SERIES, LOW LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, CQFP24 |
| 封装： | CERQUAD-24 |
| 文件页数： | 8/12页 |
| 文件大小： | 188K |
| 代理商： | RM100355WFQMLV |
Military Version
AC Electrical Characteristics
V
EE = 4.2V to 5.7V, VCC = VCCA = GND
Symbol
Parameter
T
C = 55C
T
C = +25C
T
C = +125C
Units
Conditions
Notes
Min
Max
Min
Max
Min
Max
t
PLH
Propagation Delay
t
PHL
D
na–Dnd to Output
0.40
2.30
0.50
2.20
0.50
2.60
ns
(Transparent Mode)
t
PLH
Propagation Delay
Figures 1, 2
(Notes 8, 9,
10)
t
PHL
S
0,S1 to Output
0.60
3.00
0.80
2.70
0.80
3.20
ns
(Transparent Mode)
t
PLH
Propagation Delay
0.50
2.60
0.60
2.30
0.70
2.70
ns
t
PHL
E
1,E2 to Output
t
PLH
Propagation Delay
0.60
2.80
0.70
2.60
0.70
2.90
ns
Figures 1, 3
(Notes 8, 9,
10)
t
PHL
MR to Output
t
TLH
Transition Time
0.40
1.90
0.40
1.90
0.40
1.90
ns
Figures 1, 2
(Note 11)
t
THL
20% to 80%,80% to 20%
t
S
Setup Time
D
na–Dnd
0.90
ns
Figure 4
(Note 11)
S
0,S1
2.40
MR (Release Time)
1.50
Figure 3
t
H
Hold Time
D
na–Dnd
0.40
ns
Figure 4
(Note 11)
S
0,S1
0.00
t
pw (L)
Pulse Width LOW E
1,E2
2.00
ns
Figure 2
(Note 11)
t
pw (H)
Pulse Width HIGH MR
2.00
ns
Figure 3
(Note 11)
Note 8: F100K 300 Series cold temperature testing is performed by temperature soaking (to guarantee junction temperature equals 55C), then testing immediately
without allowing for the junction temperature to stabilize due to heat dissipation after power-up. This provides “cold start” specs which can be considered a worst case
condition at cold temperatures.
Note 9: Screen tested 100% on each device at +25C, Temperature only, Subgroup A9.
Note 10: Sample tested (Method 5005, Table 1) on each Mfg. lot at +25, Subgroup A9, and at +125C, and 55C Temp., Subgroups A10 & A11.
Note 11: Not tested at +25C, +125C and 55C Temperature (design characterization data).
5
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