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参数资料
型号： RN80532KC041512
厂商： INTEL CORP
元件分类： 微控制器/微处理器
英文描述： 32-BIT, 2000 MHz, MICROPROCESSOR, CPGA603
封装： Interposer, Micro, PGA-603
文件页数： 97/129页
文件大小： 1640K
代理商： RN80532KC041512
Contents
Datasheet
7
Tables
1
Front Side Bus-to-Core Frequency Ratio ...................................................................................... 17
2
Front Side Bus Clock Frequency Select Truth Table for BSEL[1:0] .............................................. 17
3
Voltage Identification Definition ..................................................................................................... 21
4
Front Side Bus Signal Groups ....................................................................................................... 23
5
Processor Absolute Maximum Ratings.......................................................................................... 24
6
Voltage and Current Specifications ...............................................................................................26
7
Front Side Bus Differential BCLK Specifications ........................................................................... 28
8
AGTL+ Signal Group DC Specifications........................................................................................ 29
9
TAP and PWRGOOD Signal Group DC Specifications ................................................................. 29
10
Asynchronous GTL+ Signal Group DC Specifications .................................................................. 30
11
SMBus Signal Group DC Specifications........................................................................................ 30
12
BSEL[1:0] and VID[4:0] DC Specifications .................................................................................... 31
13
AGTL+ Bus Voltage Definitions ..................................................................................................... 31
14
Front Side Bus Differential Clock Specifications ........................................................................... 32
15
Front Side Bus Common Clock AC Specifications ........................................................................ 33
16
Front Side Bus Source Synchronous AC Specifications ...............................................................33
17
Miscellaneous Signals+ AC Specifications.................................................................................... 34
18
Front Side Bus AC Specifications (Reset Conditions) ................................................................... 35
19
TAP Signal Group AC Specifications ............................................................................................35
20
SMBus Signal Group AC Specifications ........................................................................................ 35
21
BCLK Signal Quality Specifications ...............................................................................................45
22
Ringback Specifications for AGTL+ and Asynchronous GTL+ Buffers ......................................... 46
23
Ringback Specifications for TAP Buffers .......................................................................................47
24
Source Synchronous (400 MHz) AGTL+ Signal Group Overshoot/Undershoot Tolerance...........53
25
Source Synchronous (200 MHz) AGTL+ Signal Group Overshoot/Undershoot Tolerance...........53
26
Common Clock (100 MHz) AGTL+ Signal Group Overshoot/Undershoot Tolerance.................... 54
27
Asynchronous GTL+, PWRGOOD, and TAP Signal Groups Overshoot/Undershoot Tolerance .. 54
28
INT-mPGA Processor Package Dimensions ................................................................................. 59
29
Package Dynamic and Static Load Specifications ........................................................................ 62
30
Processor Mass ............................................................................................................................. 63
31
Processor Material Properties ....................................................................................................... 63
38
Pin Listing by Pin Name ................................................................................................................ 67
39
Pin Listing by Pin Number ............................................................................................................. 76
41
Signal Definitions........................................................................................................................... 84
42
Processor Thermal Design Power ................................................................................................. 96
43
Power-On Configuration Option Pins ............................................................................................99
44
Processor Information ROM Format............................................................................................ 105
45
Read Byte SMBus Packet ........................................................................................................... 107
46
Write Byte SMBus Packet ........................................................................................................... 107
47
Write Byte SMBus Packet ........................................................................................................... 108
48
Read Byte SMBus Packet ........................................................................................................... 108
49
Send Byte SMBus PacketReceive Byte SMBus Packet.............................................................. 109
50
ARA SMBus Packet..................................................................................................................... 109
51
SMBus Thermal Sensor Command Byte Bit Assignments .......................................................... 109
52
Thermal Reference Register Values ........................................................................................... 110
53
SMBus Thermal Sensor Status Register ..................................................................................... 111
54
SMBus Thermal Sensor Configuration Register ......................................................................... 112
55
SMBus Thermal Sensor Conversion Rate Registers .................................................................. 112
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RN80532KC041512 SL5Z9 制造商:Intel 功能描述:MPU XEON 0.13UM 2GHZ 603-PIN UFCBGA - Trays
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