参数资料
型号: S29GL032A11BFIR43
厂商: SPANSION LLC
元件分类: PROM
英文描述: 64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY
中文描述: 2M X 16 FLASH 3V PROM, 110 ns, PBGA48
封装: 8.15 X 6.15 MM, LEAD FREE, FBGA-48
文件页数: 87/95页
文件大小: 3585K
代理商: S29GL032A11BFIR43
88
S29GL-A
S29GL-A_00_A12 May 21, 2008
Da ta
Sh e e t
18. Physical Dimensions
18.1
TS048—48-Pin Standard Thin Small Outline Package (TSOP)
-X-
X = A OR B
e/2
DETAIL B
c
L
0.25MM (0.0098") BSC
0
DETAIL A
R
GAGE LINE
PARALLEL TO
SEATING PLANE
b
b1
(c)
7
6
c1
WITH PLATING
BASE METAL
7
C A-B S
M
0.08MM (0.0031")
SECTION B-B
e
0.10 C
A2
PLANE
SEATING
C
A1
SEE DETAIL B
B
SEE DETAIL A
2
STANDARD PIN OUT (TOP VIEW)
2
N
+1
N
1
4
2
A
-A-
-B-
5
9
E
5
D1
D
6
2
3
4
5
7
8
9
TS 048
MO-142 (B) EC
48
MIN
0.05
0.95
0.17
0.10
18.30
19.80
0.50
0
0.08
11.90
0.50 BASIC
MAX
0.15
1.20
0.27
0.16
0.21
5
0.20
18.50
12.10
0.70
20.20
0.23
1.05
0.20
1.00
0.22
18.40
20.00
0.60
3
12.00
NOM
Symbol
Jedec
Package
b1
A2
A1
A
D
L
e
E
D1
b
c1
c
0
R
N
1
NOTES:
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (MM).
(DIMENSIONING AND TOLERANCING CONFORMS TO ANSI Y14.5M-1982)
PIN 1 IDENTIFIER FOR STANDARD PIN OUT (DIE UP).
NOT APPLICABLE.
TO BE DETERMINED AT THE SEATING PLANE -C- . THE SEATING PLANE IS DEFINED AS THE PLANE OF
CONTACT THAT IS MADE WHEN THE PACKAGE LEADS ARE ALLOWED TO REST FREELY ON A FLAT
HORIZONTAL SURFACE.
DIMENSIONS D1 AND E DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD PROTUSION IS
0.15MM (.0059") PER SIDE.
DIMENSION b DOES NOT INCLUDE DAMBAR PROTUSION. ALLOWABLE DAMBAR PROTUSION SHALL BE
0.08 (0.0031") TOTAL IN EXCESS OF b DIMENSION AT MAX. MATERIAL CONDITION. MINIMUM SPACE
BETWEEN PROTRUSION AND AN ADJACENT LEAD TO BE 0.07 (0.0028").
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10MM (.0039") AND
0.25MM (0.0098") FROM THE LEAD TIP.
LEAD COPLANARITY SHALL BE WITHIN 0.10MM (0.004") AS MEASURED FROM THE SEATING PLANE.
DIMENSION "e" IS MEASURED AT THE CENTERLINE OF THE LEADS.
3325 \ 16-038.10a
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