20
80960SB
3.0
MECHANICAL DATA
3.1
Packaging
The 80960SB is available in two package types:
80-lead quad flat pack (EIAJ QFP). Shown in
Figure 15.
84-lead plastic leaded chip carrier (PLCC).
Shown in Figure 16.
Dimensions for both package types are given in the
Intel Packaging handbook (Order #240800).
3.2
Pin Assignment
The QFP and PLCC have different pin assignments.
The QFP pins are numbered in order from 1 to 80
around the package perimeter. The PLCC pins are
numbered in order from 1 to 84 around the package
perimeter. Tables 9 and 10 list the function of each
QFP pin; Tables 11 and 12 list the function of each
PLCC pin.
VCC and GND connections must be made to multiple
VCC and GND pins. Each VCC and GND pin must be
connected to the appropriate voltage or ground and
externally strapped close to the package. It is recom-
mended that you include separate power and ground
planes in your circuit board for power distribution.
Pins identified as NC (No Connect) should never be
connected.
Figure 15. 80-Lead EIAJ Quad Flat Pack (QFP) Package
A
S
AD1
AD2
VSS
AD3
AD4
AD5
AD6
AD
7
AD
8
AD
9
A
D
10
A
D
11
A
D
12
A
D
13
A
D
14
A
D
15
A
16
A
17
A
18
A
19
A
20
A
21
A
22
VSS
A23
A24
A25
B
LA
S
T
H
O
LD
V
S
R
E
S
ET
V
C
LK
2
IN
T3
/IN
TA
IN
T2
/IN
TR
IN
T1
IN
T0
V
C
V
C
N
C
V
S
V
S
V
C
V
C
V
S
V
S
VCC
NC
VSS
VCC
V
C
VCC
H
LD
A
ALE
A1
A2
A3
D0
W
/R
READY
D
T/
R
B
E
0
BE1
V
S
LO
C
K
D
E
N
V
S
V
S
V
C
V
C
66
65
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41
40
39
38
37
36
35
34
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21
80
79
78
77
76
75
74
73
72
71
70
69
68
67
22 23 24
25
26
27
28
29
30
31
32
33
A26
A27
A28
A29
A30
A31
x80960SB-16
XXXXXXXX
XXXXXX
NOTE: To address the fact that many of the package prefix variables have changed,
all package prefix variables in this document are now indicated with an "x".