1998 Dec 14
2
Philips Semiconductors
Preliminary specication
Economy teletext and TV microcontrollers
SAA5x9x family
CONTENTS
1
FEATURES
1.1
General
1.2
Microcontroller
1.3
Teletext acquisition
1.4
Teletext Display
1.5
Additional features of SAA529xA devices
1.6
Additional features of SAA549x devices
2
GENERAL DESCRIPTION
2.1
Device masking history
3
ORDERING INFORMATION
4
QUICK REFERENCE DATA
5
BLOCK DIAGRAM
6
PINNING INFORMATION
6.1
Pinning
6.2
Pin description
7
FUNCTIONAL DESCRIPTION
7.1
Microcontroller
7.2
80C51 features not supported
7.3
Additional features
7.4
Microcontroller interfacing
8
TELETEXT DECODER
8.1
Data slicer
8.2
Acquisition timing
8.3
Teletext acquisition
8.4
Rolling headers and time
8.5
Error checking
8.6
Memory organisation of SAA5296/7,
SAA5296/7A and SAA5496/7
8.7
Inventory page
8.8
Memory organisation of SAA5290, SAA5290A,
SAA5291, SAA5291A and SAA5491
8.9
Packet 26 processing
8.10
VPS
8.11
Wide Screen Signalling (SAA529xA and
SAA549x only)
8.12
525-line world system teletext
8.13
Fastext detection
8.14
Page clearing
8.15
Full channel operation
8.16
Independent data services (SAA5290,
SAA5290A, SAA5291, SAA5291A and
SAA5491 only)
9
THE DISPLAY
9.1
Introduction
9.2
Character matrix
9.3
East/West selection
9.4
National option characters
9.5
The twist attribute
9.6
Language group identification
9.7
525-line operation
9.8
On-Screen Display characters
9.9
Control characters
9.10
Quadruple width display (SAA549x)
9.11
Page attributes
9.12
Display modes
9.13
On-Screen Display boxes
9.14
Screen colour
9.15
Redefinable colours (SAA549x)
9.16
Cursor
9.17
Other display features
9.18
Display timing
9.19
Horizontal timing
9.20
Vertical timing
9.21
Display position
9.22
Clock generator
9.23
Reset signal
10
CHARACTER SETS
10.1
Pan-European
10.2
Cyrillic
10.3
Greek/Turkish
10.4
Arabic/English/French
10.5
Thai
10.6
Arabic/Hebrew
10.7
Iranian
11
LIMITING VALUES
12
CHARACTERISTICS
13
CHARACTERISTICS FOR THE I2C-BUS
INTERFACE
14
QUALITY AND RELIABILITY
15
APPLICATION INFORMATION
16
EMC GUIDELINES
17
PACKAGE OUTLINES
18
SOLDERING
18.1
Introduction
18.2
Through-hole mount packages
18.3
Surface mount packages
18.4
Suitability of IC packages for wave, reflow and
dipping soldering methods
19
DEFINITIONS
20
LIFE SUPPORT APPLICATIONS
21
PURCHASE OF PHILIPS I2C COMPONENTS