参数资料
| 型号： | SAA7706H/N210,518 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 43/52页 |
| 文件大小： | 0K |
| 描述： | IC CAR RADIO DSP 80-QFP |
| 标准包装： | 500 |
| 类型： | 汽车信号处理器 |
| 接口： | I²C，I²:S，LSB，SPDIF |
| 电压 - 输入/输出： | 3.30V |
| 电压 - 核心： | 3.30V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 80-BQFP |
| 供应商设备封装： | 80-QFP（14x20） |
| 包装： | 带卷 (TR) |
| 其它名称： | 935270285518 SAA7706H/N210-T SAA7706H/N210-T-ND |
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2001 Mar 05
48
Philips Semiconductors
Product specication
Car radio Digital Signal Processor (DSP)
SAA7706H
18.5
Suitability of surface mount IC packages for wave and reow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW(1)
BGA, LFBGA, SQFP, TFBGA
not suitable
suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
not suitable(2)
suitable
PLCC(3), SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended(3)(4)
suitable
SSOP, TSSOP, VSO
not recommended(5)
suitable
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SAA7707H | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Car radio Digital Signal Processor CDSP |
| SAA7708H | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Car Radio Digital Signal Processor |
| SAA7709/N107 | 制造商:PHILIPS-SEMI 功能描述: |
| SAA7709H/N103 | 功能描述:音频 DSP DIGITAL SIGNAL PROCESSOR RoHS:否 制造商:Texas Instruments 工作电源电压: 电源电流: 工作温度范围: 安装风格: 封装 / 箱体: 封装:Tube |
| SAA7709H/N103,518 | 功能描述:音频 DSP DIRAC-2 RoHS:否 制造商:Texas Instruments 工作电源电压: 电源电流: 工作温度范围: 安装风格: 封装 / 箱体: 封装:Tube |
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