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| 型号： | SC16IS850LIPW |
| 厂商： | NXP Semiconductors N.V. |
| 元件分类： | 连接器件 |
| 英文描述： | Single UART with I2C-bus-SPI interface, 128 bytes of transmit and receive FIFOs, IrDA SIR built-in support |
| 封装： | SC16IS850LIBS<SOT616-3 (HVQFN24)|<<http://www.nxp.com/packages/SOT616-3.html<1<Always Pb-free,;SC16IS850LIBS<SOT616-3 (HVQFN24)|<<http://www.nxp.com/packages/SOT616-3.htm |
| 文件页数： | 2/60页 |
| 文件大小： | 755K |
| 代理商： | SC16IS850LIPW |
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SC16IS850L
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 — 22 July 2011
2 of 60
NXP Semiconductors
SC16IS850L
Single UART with I
2
C-bus/SPI interface
Transmitter and receiver can be enabled/disabled independent of each other
Receive and Transmit FIFO levels
Programmable special character detection
Fully programmable character formatting
5-bit, 6-bit, 7-bit or 8-bit character
Even, odd, or no parity
1, 1
1
2
, or 2 stop bits
Line break generation and detection
Internal Loopback mode
Sleep current less than 5
A at 1.8 V
Industrial and commercial temperature ranges
Available in HVQFN24 and TSSOP24 packages
2.2 I
2
C-bus features
400 kbit/s maximum speed
Compliant with I
2
C-bus Fast-mode (Fm) speed
Slave mode only
2.3 SPI features
Supports 12 Mbit/s maximum SPI clock speed
Slave mode only
SPI Mode 0
3. Applications
Factory automation and process control
Portable and battery operated devices
Cellular data devices
4. Ordering information
Table 1.
Type number
Ordering information
Package
Name
HVQFN24
Description
plastic thermal enhanced very thin quad flat package; no leads;
24 terminals; body 4
4
0.85 mm
plastic thin shrink small outline package; 24 leads; body width 4.4 mm
Version
SOT616-3
SC16IS850LIBS
SC16IS850LIPW
TSSOP24
SOT355-1
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| SC16IS850LIPW,118 | 制造商:NXP Semiconductors 功能描述:Single UART with I2C-bus/SPI interface 制造商:NXP Semiconductors 功能描述:SC16IS850LIPW/TSSOP24/REEL13// - Tape and Reel 制造商:NXP Semiconductors 功能描述:IC INTERFACE UART |
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