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参数资料
| 型号： | SFC05-4.TM |
| 元件分类： | TVS二极管 - 瞬态电压抑制 |
| 英文描述： | 300 W, UNIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE, MO-211BB |
| 封装： | FLIP CHIP, CSP-6 |
| 文件页数： | 1/8页 |
| 文件大小： | 190K |
| 代理商： | SFC05-4.TM |
PROTECTION PRODUCTS
1
www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
SFC05-4
ChipClampΤΜ
ΤΜ
Flip Chip TVS Diode Array
Description
Features
Device Dimensions
Schematic & PIN Configuration
Revision 11/21/03
The SFC05-4 is a quad flip chip CSP TVS diode array.
They are state-of-the-art devices that utilize solid-state
silicon-avalanche technology for superior clamping
performance and DC electrical characteristics. The
SFC series TVS diodes are designed to protect sensi-
tive semiconductor components from damage or latch-
up due to electrostatic discharge (ESD) and other
voltage induced transient events.
The SFC05-4 is a 6-bump, 0.5mm pitch flip chip array
with a 3x2 bump grid. It measures 1.5 x 1.0 x
0.65mm. This small outline makes the SFC05-4
especially well suited for portable applications. CSP
TVS devices are compatible with current pick and place
equipment and assembly methods.
Each device will protect up to four data or I/O lines.
The CSP design results in lower inductance, virtually
eliminating voltage overshoot due to leads and inter-
connecting bond wires. They may be used to meet the
ESD immunity requirements of IEC 61000-4-2, Level 4
(±15kV air, ±8kV contact discharge).
Applications
Mechanical Characteristics
! Cell Phone Handsets and Accessories
! Personal Digital Assistants (PDA’s)
! Notebook and Hand Held Computers
! Portable Instrumentation
! Pagers
! Smart Cards
! MP3 Players
! GPS
! 300 Watts peak pulse power (t
p = 8/20s)
! Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lightning) 24A (8/20s)
! Small chip scale package requires less board space
! Low profile (< 0.65mm)
! No need for underfill material
! Protects four I/O or data lines
! Low clamping voltage
! Working voltage: 5V
! Solid-state silicon-avalanche technology
! JEDEC MO-211, Variation BB, 0.50 mm Pitch Chip
Scale Package (CSP)
! Marking : Marking Code
! Packaging : Tape and Reel
SFC05-4 Maximum Dimensions (mm)
3 x 2 Grid CSP TVS (Bottom View)
相关PDF资料 |
PDF描述 |
|---|---|
| SFC05-4.WFT | 300 W, UNIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE, MO-211BB |
| SFC05-4.WMT | 300 W, UNIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE, MO-211BB |
| SFC05-5-T710-2 | 250 W, UNIDIRECTIONAL, 5 ELEMENT, SILICON, TVS DIODE |
| SFC05-5.WMT | 200 W, UNIDIRECTIONAL, 5 ELEMENT, SILICON, TVS DIODE, MO-211BB |
| SFF1605G | 16 A, 300 V, SILICON, RECTIFIER DIODE, TO-220AB |
相关代理商/技术参数 |
参数描述 |
|---|---|
| SFC05-5 | 制造商:PROTEC 制造商全称:Protek Devices 功能描述:FLIP CHIP ARRAY |
| SFC05-5.TC | 制造商:Semtech Corporation 功能描述:CHIPCLAMP FLIP CHIP TVS DIODE ARRAY |
| SFC05-5.WCT | 制造商:Semtech Corporation 功能描述:Diode |
| SFC05-5_07 | 制造商:PROTEC 制造商全称:Protek Devices 功能描述:FLIP CHIP ARRAY |
| SFC05-5_10 | 制造商:PROTEC 制造商全称:Protek Devices 功能描述:250w flip chip tvs array |
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