参数资料
型号: SI2457-D-GT
厂商: Silicon Laboratories Inc
文件页数: 50/60页
文件大小: 0K
描述: IC ISOMODEM GLOBAL DAA 24TSSOP
标准包装: 62
系列: *
Si2457/34/15/04
54
Rev. 1.3
12. Package Outline: 24-Pin TSSOP
Figure 21 illustrates the package details for the Si2457/34/15/04 24-pin packaging option. Table 15 lists the values
for the dimensions shown in the illustration.
Figure 21. 24-Pin Thin Shrink Small Outline Package (TSSOP)
Table 15. Package Diagram Dimensions
Dimension
Min
Nom
Max
A—
1.20
A1
0.05
0.15
A2
0.80
1.00
1.05
b
0.19
0.30
c
0.09
0.20
D
7.70
7.80
7.90
E
6.40 BSC
E1
4.30
4.40
4.50
e
0.65 BSC
L
0.45
0.60
0.75
L2
0.25 BSC
θ
aaa
0.10
bbb
0.10
ccc
0.20
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to the JEDEC Solid State Outline MO-153,
Variation AD.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020
specification for Small Body Components.
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