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参数资料
型号： SI3050-E1-FT
厂商： Silicon Laboratories Inc
文件页数： 31/128页
文件大小： 0K
描述： IC VOICE DAA SYSTEM SIDE 20TSSOP
标准包装： 74
系列： *
Si3050 + Si3011/18/19
126
Rev. 1.5
DOCUMENT CHANGE LIST
Revision 1.01 to Revision 1.1
Added package thermal information in Table 1,
“Recommended Operating Conditions and Thermal
Information,” on page 5.
Added Note 10 to the transhybrid balance parameter
in Table 4 on page 8.
Updated Table 7, “Switching Characteristics—Serial
Peripheral Interface,” on page 11.
Removed R54 and R55 from " " on page 18.
Changed recommended DCV setting for Japan from
01 to 10 in Table 13 on page 22.
Updated initialization procedure in "5.3. Initialization"
on page 25.
Removed incorrect description of FDT bit in "5.8.
Exception Handling" on page 27.
Updated Billing Tone and Receive Overload section.
Changed to "5.22. Receive Overload Detection" on
page 35.
Updated text and added description of hybrid
coefficient format in "5.28. Transhybrid Balance" on
page 38.
Removed references to line-side revisions C and E.
Updated "8. Ordering Guide" on page 106.
Updated package information for 20-Pin TSSOP and
16-Pin SOIC on pages 103 and 104.
Added “14.Package Outline: 16-Pin TSSOP”.
Revision 1.1 to Revision 1.2
Updated Table 7, “Switching Characteristics—Serial
Peripheral Interface,” on page 11.
Updated delay time between chip selects.
Updated Table 13, “Country-specific Register
Settings,” on page 22.
Corrected ACIM settings for Brazil.
Updated "5.3. Initialization" on page 25.
Revised Step 6 with standard hexadecimal notation.
Updated Figure 27, “Si3011/18/19 Signal Flow
Diagram,” on page 38.
Corrected HPF pole.
Updated "8. Ordering Guide" on page 106.
Revision 1.2 to Revision 1.3
Updated Deep Sleep Total Supply Current from 1.0
to 1.3 mA typical
Updated package pictures
Removed all SPIM references (SPIM bit is never
present in any Si3050 device).
Removed SnPb package options
Minor typo corrections
Revision 1.1 to Revision 1.31
The internal System-Side Revision value (REVA[3:0]
in Register 11) has been incremented by one for
Si3050 revision E.
Revision 1.31 to Revision 1.4
Added Si3011 device specifications
Added Si3050, Si3011, Si3018, and Si3019 QFN
information
Revision 1.4 to Revision 1.5
Updated "3. Bill of Materials" on page 19.
Updated "8. Ordering Guide" on page 106.
Updated Si3050 part numbers to reflect the latest
product revision level.
Corrected Si3011 bit settings for Register 26 [7:6
and 5:4].
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相关代理商/技术参数
参数描述
SI3050-E1-FTR 制造商:Silicon Laboratories Inc 功能描述:Voice DAA Chipset 20-Pin TSSOP T/R 制造商:Silicon Laboratories Inc 功能描述:SI3050 VOICE DAA SYSTEM-SIDE - Tape and Reel 制造商:Silicon Laboratories Inc 功能描述:3.3VH PROGRAMMABLE VOICE DAA SYSTM-SIDE 制造商:Silicon Laboratories Inc 功能描述:IC VOICE DAA SYSTEM SIDE 20TSSOP 制造商:Silicon Laboratories Inc 功能描述:Si3050 Voice DAA System-Side
Si3050-E1-GM 功能描述:电信线路管理 IC System-side Voice DAA RoHS:否 制造商:STMicroelectronics 产品:PHY 接口类型:UART 电源电压-最大:18 V 电源电压-最小:8 V 电源电流:30 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:VFQFPN-48 封装:Tray
SI3050-E1-GMR 制造商:Silicon Laboratories Inc 功能描述:SI3050 VOICE DAA SYSTEM-SIDE - LEAD-FREE - Tape and Reel 制造商:Silicon Laboratories Inc 功能描述:IC VOICE DAA SYSTEM SIDE 24QFN 制造商:Silicon Laboratories Inc 功能描述:Si3050 Voice DAA System-Side
Si3050-E1-GT 功能描述:电信线路管理 IC System-side Voice DAA RoHS:否 制造商:STMicroelectronics 产品:PHY 接口类型:UART 电源电压-最大:18 V 电源电压-最小:8 V 电源电流:30 mA 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:VFQFPN-48 封装:Tray
SI3050-E1-GTR 制造商:Silicon Laboratories Inc 功能描述:SI3050 VOICE DAA SYSTEM-SIDE - Tape and Reel 制造商:Silicon Laboratories Inc 功能描述:IC VOICE DAA SYSTEM SIDE 24QFN 制造商:Silicon Laboratories Inc 功能描述:Si3050 Voice DAA System-Side
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