参数资料
型号: SI5100-G-BC
厂商: Silicon Laboratories Inc
文件页数: 31/40页
文件大小: 0K
描述: IC TXRX SERIAL/DESERIAL 195CBGA
标准包装: 126
系列: SiPHY™
类型: 收发器
驱动器/接收器数: 1/1
规程: SONET/SDH
电源电压: 1.71 V ~ 1.89 V
安装类型: 表面贴装
封装/外壳: 195-BBGA
供应商设备封装: 195-BGA(15x15)
包装: 托盘
其它名称: 336-1308
SI5100-G-BC-ND
Si5100
Rev. 1.5
37
20. 15x15 mm 195L PBGA Recommended PCB Layout
Notes:
General
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
Solder Mask Design
1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to
be 60 m minimum, all the way around the pad.
Stencil Design
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder
paste release.
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1.
Card Assembly
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for Small Body Components.
Symbol
Min
Nom
Max
X
0.40
0.45
0.50
C1
13.00
C2
13.00
E1
1.00
E2
1.00
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