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| 型号： | SIE800DF-T1-GE3 |
| 厂商： | Vishay Siliconix |
| 文件页数： | 1/10页 |
| 文件大小： | 0K |
| 描述： | MOSFET N-CH D-S 30V POLARPAK |
| 标准包装： | 3,000 |
| 系列： | TrenchFET® |
| FET 型： | MOSFET N 通道，金属氧化物 |
| FET 特点： | 标准 |
| 漏极至源极电压(Vdss)： | 30V |
| 电流 - 连续漏极(Id) @ 25° C： | 50A |
| 开态Rds（最大）@ Id, Vgs @ 25° C： | 7.2 毫欧 @ 11A，10V |
| Id 时的 Vgs(th)（最大）： | 3V @ 250µA |
| 闸电荷(Qg) @ Vgs： | 35nC @ 10V |
| 输入电容 (Ciss) @ Vds： | 1600pF @ 15V |
| 功率 - 最大： | 104W |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-PolarPAK?（S） |
| 供应商设备封装： | 10-PolarPAK?（S） |
| 包装： | 带卷 (TR) |
SiE800DF
Vishay Siliconix
N-Channel 30 V (D-S) MOSFET
PRODUCT SUMMARY
I D (A) a
FEATURES
? Halogen-free According to IEC 61249-2-21
Definition
V DS (V)
30
R DS(on) ( Ω )
0.0072 at V GS = 10 V
0.0115 at V GS = 4.5 V
Silicon
Limit
90
73
Package
Limit
50
50
Q g (Typ.)
12 nC
? Extremely Low Q gd for Low Switching Losses
? TrenchFET ? Power MOSFET
? Ultra Low Thermal Resistance Using Top-
Exposed PolarPAK ? Package for Double-Sided
Cooling
? Leadframe-Based New Encapsulated Package
Package Drawing
www.vishay.com/doc?73398
PolarPAK
- Die Not Exposed
- Same Layout Regardless of Die Size
? Low Q gd /Q gs Ratio Helps Prevent Shoot-Through
? 100 % R g and UIS Tested
10
9
8
7
6
? Compliant to RoHS Directive 2002/95/EC
D
G
S
S
D
6
7
8
9
10
APPLICATIONS
? VRM
? DC/DC Conversion: High-Side
D
D
S
G
D
? Synchronous Rectification
D
D
G
S
S
D
5
4
3
2
1
G
1
2
3
4
5
Top V ie w
Top s u rface is connected to pins 1, 5, 6, and 10
Bottom V ie w
S
N -Channel MOSFET
Orderin g Information: SiE 8 00DF-T1-E3 (Lead (P b )-free)
SiE 8 00DF -T1-GE3 (Lead (P b )-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS (T A = 25 °C, unless otherwise noted)
For Related Documents
www.vishay.com/ppg?74414
Parameter
Drain-Source Voltage
Gate-Source Voltage
T C = 25 °C
Symbol
V DS
V GS
Limit
30
± 20
90 (Silicon Limit)
50 a (Package Limit)
Unit
V
Continuous Drain Current (T J = 150 °C)
Pulsed Drain Current
Continuous Source-Drain Diode Current
T C = 70 °C
T A = 25 °C
T A = 70 °C
T C = 25 °C
T A = 25 °C
I D
I DM
I S
50 a
20.6 b, c
16.5 b, c
60
50 a
4.3 b, c
A
Single Pulse Avalanche Current
Avalanche Energy
L = 0.1 mH
I AS
E AS
40
80
mJ
T C = 25 °C
104
Maximum Power Dissipation
T C = 70 °C
T A = 25 °C
P D
66
5.2 b, c
W
T A = 70 °C
3.3 b, c
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) d, e
T J , T stg
- 55 to 150
260
°C
Notes:
a. Package limited is 50 A.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile ( www.vishay.com/doc?73257 ). The PolarPAK is a leadless package. The end of the lead terminal is exposed copper (not
plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 73199
S11-0212-Rev. G, 14-Feb-11
www.vishay.com
1
相关PDF资料 |
PDF描述 |
|---|---|
| SIE802DF-T1-GE3 | MOSFET N-CH D-S 30V POLARPAK |
| SIE804DF-T1-GE3 | MOSFET N-CH D-S 150V POLARPAK |
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| SIE830DF-T1-GE3 | MOSFET N-CH D-S 30V POLARPAK |
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| SIE802DF-T1-GE3 | 功能描述:MOSFET 30V 202A 125W 1.9mohm @ 10V RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS（导通）:0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube |
| SIE804DF-T1-GE3 | 功能描述:MOSFET 150V 37A 125W 38mohm @ 10V RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS（导通）:0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube |
| SIE806DF | 制造商:VISHAY 制造商全称:Vishay Siliconix 功能描述:N-Channel 30-V (D-S) MOSFET |
| SIE806DF-T1-E3 | 功能描述:MOSFET 30V 60A 125W 1.7mohm @ 10V RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS（导通）:0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube |
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