参数资料
型号: SIHF18N50D-E3
厂商: Vishay Siliconix
文件页数: 2/8页
文件大小: 0K
描述: MOSFET N-CH 500V 18A TO-220FP
标准包装: 1,000
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 500V
电流 - 连续漏极(Id) @ 25° C: 18A
开态Rds(最大)@ Id, Vgs @ 25° C: 280 毫欧 @ 9A,50V
Id 时的 Vgs(th)(最大): 5V @ 250µA
闸电荷(Qg) @ Vgs: 76nC @ 10V
输入电容 (Ciss) @ Vds: 1500pF @ 100V
功率 - 最大: 39W
安装类型: 通孔
封装/外壳: TO-220-3 整包
供应商设备封装: TO-220 整包
包装: 管件
SiHF18N50D
www.vishay.com
THERMAL RESISTANCE RATINGS
Vishay Siliconix
PARAMETER
Maximum Junction-to-Ambient
Maximum Junction-to-Case (Drain)
SYMBOL
R thJA
R thJC
TYP.
-
-
MAX.
65
3.2
UNIT
°C/W
SPECIFICATIONS (T J = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
Static
Drain-Source Breakdown Voltage
V DS Temperature Coefficient
Gate Threshold Voltage (N)
Gate-Source Leakage
Zero Gate Voltage Drain Current
V DS
? V DS /T J
V GS(th)
I GSS
I DSS
V GS = 0 V, I D = 250 μA
Reference to 25 °C, I D = 250 μA
V DS = V GS , I D = 250 μA
V GS = ± 30 V
V DS = 500 V, V GS = 0 V
V DS = 400 V, V GS = 0 V, T J = 125 °C
500
-
3.0
-
-
-
-
0.58
-
-
-
-
-
-
5.0
± 100
1
10
V
V/°C
V
nA
μA
Drain-Source On-State Resistance
R DS(on)
V GS = 10 V
I D = 9 A
-
0.23
0.28
?
Forward
Transconductance a
g fs
V DS = 50 V, I D = 9 A
-
6.4
-
S
Dynamic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
C iss
C oss
C rss
V GS = 0 V,
V DS = 100 V,
f = 1.0 MHz
-
-
-
1500
131
14
-
-
-
Effective Output Capacitance, Energy
Related a
Effective Output Capacitance, Time
Related c
Total Gate Charge
C o(er)
C o(tr)
Q g
V GS = 0 V, V DS = 0 V to 400 V
-
-
-
113
164
38
-
-
76
pF
Gate-Source Charge
Q gs
V GS = 10 V
I D = 9 A, V DS = 400 V
-
11
-
nC
Gate-Drain Charge
Turn-On Delay Time
Q gd
t d(on)
-
-
17
19
-
38
Rise Time
Turn-Off Delay Time
Fall Time
Gate Input Resistance
t r
t d(off)
t f
R g
V DD = 400 V, I D = 9 A,
V GS = 10 V, R g = 9.1 ?
f = 1 MHz, open drain
-
-
-
-
36
36
30
1.7
72
72
60
-
ns
?
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulsed Diode Forward Current
I S
I SM
MOSFET symbol
showing the
integral reverse
P - N junction diode
G
D
S
-
-
-
-
18
72
A
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
V SD
t rr
Q rr
I RRM
T J = 25 °C, I S = 9 A, V GS = 0 V
T J = 25 °C, I F = I S = 9 A,
dI/dt = 100 A/μs, V R = 20 V
-
-
-
-
-
354
3.9
21
1.2
-
-
-
V
ns
μC
A
Note
a. C oss(er) is a fixed capacitance that gives the same energy as C oss while V DS is rising from 0 % to 80 % V DSS .
b. C oss(tr) is a fixed capacitance that gives the same charging time as C oss while V DS is rising from 0 % to 80 % V DSS .
S12-1228-Rev. A, 21-May-12
2
Document Number: 91507
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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