参数资料
型号: SIJ458DP-T1-GE3
厂商: Vishay Siliconix
文件页数: 1/7页
文件大小: 0K
描述: MOSFET N-CH 30V 8-SOIC
标准包装: 1
系列: TrenchFET®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 60A
开态Rds(最大)@ Id, Vgs @ 25° C: 2.2 毫欧 @ 20A,10V
Id 时的 Vgs(th)(最大): 2.5V @ 250µA
闸电荷(Qg) @ Vgs: 122nC @ 10V
输入电容 (Ciss) @ Vds: 4810pF @ 15V
功率 - 最大: 69.4W
安装类型: 表面贴装
封装/外壳: PowerPAK? SO-8
供应商设备封装: PowerPAK? SO-8
包装: 剪切带 (CT)
其它名称: SIJ458DP-T1-GE3CT

New Product
SiJ458DP
Vishay Siliconix
N-Channel 30 V (D-S) MOSFET
PRODUCT SUMMARY
V DS (V) R DS(on) ( Ω )
I D (A) a, g
Q g (Typ.)
FEATURES
? Halogen-free According to IEC 61249-2-21
Definition
30
0.0022 at V GS = 10 V
0.0026 at V GS = 4.5 V
60
60
40.6 nC
? TrenchFET ? Power MOSFET
? 100 % R g Tested
? 100 % UIS Tested
PowerPAK ? SO-8L Single
? Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
5m
6.1
m
5 . 1 3
mm
?
?
POL
VRM
D
?
DC/DC Converters
D
?
High Current Switching
4
G
S
3
S
2
S
1
G
S
Ordering Information: SiJ458DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS T A = 25 °C, unless otherwise noted
N-Channel MOSFET
Parameter
Drain-Source Voltage
Gate-Source Voltage
T C = 25 °C
Symbol
V DS
V GS
Limit
30
± 20
60 g
Unit
V
Continuous Drain Current (T J = 150 °C)
T C = 70 °C
T A = 25 °C
I D
60 g
35.5 b, c
Pulsed Drain Current
Continuous Source-Drain Diode Current
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
T A = 70 °C
T C = 25 °C
T A = 25 °C
L = 0.1 mH
I DM
I S
I AS
E AS
28.4 b, c
80
60 g
4.5 b, c
40
80
A
mJ
T C = 25 °C
69.4
Maximum Power Dissipation
T C = 70 °C
T A = 25 °C
P D
44.4
5.0 b, c
W
T A = 70 °C
3.2 b, c
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) d, e
T J , T stg
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient b, f
Maximum Junction-to-Case (Drain)
t ≤ 10 s
Steady State
R thJA
R thJC
20
1.3
25
1.8
°C/W
Notes:
a. Based on T C = 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile ( www.vishay.com/ppg?73257 ). The PowerPAK SO-8L is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 65 °C/W.
g. Package limited.
Document Number: 65709
S10-0640-Rev. A, 22-Mar-10
www.vishay.com
1
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