参数资料
型号: SIW3500GIG3
厂商: RF MICRO DEVICES INC
元件分类: 通信及网络
英文描述: SPECIALTY TELECOM CIRCUIT, PBGA96
封装: 6 X 6 MM, GREEN, VFBGA-96
文件页数: 13/28页
文件大小: 795K
代理商: SIW3500GIG3
Preliminary
20 of 28
SiW3500
60 0066 R00JIrf SiW3500 UltimateBlue SoC DS
80
MFP[6]
C7
582.5
1458.45
81
MFP[7]
C6
457.5
1675
82
XTAL_N
B7
332.5
1446.95
83
XTAL_P/CLK
A7
105
1675
84
VCC
B6
-20
1458.45
85
VTUNE
A6
-145
1675
86
GND
A5
-180.5
1241.9
87
GND
B5
-395
1675
88
VCC
C4
-644.5
1241.9
89
TX_BIAS
A4
-645
1675
90
GND
B4
-770
1458.45
91
GND
A3
-895
1675
92
RF_IO
A2
-1145
1675
93
GND
B2
-1399.15
1458.5
94
VCC
A1
-1526
1675
1 Ball number information is provided as a reference to the 6-by-6-mm BGA packaged device.
2 X, Y bump locations are referenced to the center of the die.
Die Bump No.
Net Name
Ball No.
See Note 1
X (m)
See Note 2
Y (m)
See Note 2
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