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参数资料
型号： SPC5643AF0MLU2
厂商： FREESCALE SEMICONDUCTOR INC
元件分类： 微控制器/微处理器
英文描述： MICROCONTROLLER, PQFP176
封装： 24 X 24 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, LQFP-176
文件页数： 116/142页
文件大小： 886K
代理商： SPC5643AF0MLU2
Electrical characteristics
MPC5644A Microcontroller Data Sheet, Rev. 4
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
75
Table 10. Thermal characteristics for 208-pin MAPBGA1
1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.
Symbol
C
Parameter
Conditions
Value
Unit
RJA
CC
D Junction-to-Ambient, Natural Convection2,3
2 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
3 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
One layer board - 1s
39
°C/W
RJA
CC
D Junction-to-Ambient, Natural Convection2,4
4 Per JEDEC JESD51-6 with the board horizontal.
Four layer board - 2s2p
24
°C/W
RJMA
CC
D Junction-to-Moving-Air, Ambient2,4
@200 ft./min., one layer
board
31
°C/W
RJMA
CC
D Junction-to-Moving-Air, Ambient2,4
@200 ft./min., four layer
board 2s2p
20
°C/W
RJB
CC
D Junction-to-board5
5 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
Four layer board - 2s2p
13
°C/W
RJC
CC
D Junction-to-case6
6 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate
method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
6°C/W
JT
CC
D Junction-to-package top natural convection7
7 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter
is written as Psi-JT.
2°C/W
Table 11. Thermal characteristics for 324-pin TEPBGA1
1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.
Symbol
C
Parameter
Conditions
Value
Unit
RJA
CC
D Junction-to-Ambient, Natural Convection2
2 Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board
meets JEDEC specification for this package.
Single layer board - 1s
29
°C/W
RJA
CC
D Junction-to-Ambient, Natural Convection2
Four layer board - 2s2p
19
°C/W
RJMA
CC
D Junction-to-Moving-Air, Ambient2
@200 ft./min., single layer
board
23
°C/W
RJMA
CC
D Junction-to-Moving-Air, Ambient2
@200 ft./min., four layer
board 2s2p
16
°C/W
RJB
CC
D Junction-to-Board3
3 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC
specification for the specified package.
10
°C/W
RJCtop
CC
D Junction-to-Case4
4 Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate
temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.
7°C/W
JT
CC
D Junction-to-Package Top, Natural
Convection5
2°C/W
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相关代理商/技术参数
参数描述
SPC5643AF0MVZ1 功能描述:32位微控制器 - MCU 32BIT3MB Flsh192KRAM RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT
SPC5643LF0MLQ1 功能描述:32位微控制器 - MCU 32BIT 1M FLASH 128K RAM 120MHZ RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT
SPC5643LF0MLQ1R 功能描述:32位微控制器 - MCU 32B 1M FLASH 128KRAM RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT
SPC5643LF0MLQ8 功能描述:32位微控制器 - MCU 32BIT1MFLASH 128K RAM RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT
SPC5643LF0MLQ8R 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:MPC5643L Microcontroller Data Sheet
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