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| 型号： | SPC5643AF0MLU2 |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | MICROCONTROLLER, PQFP176 |
| 封装： | 24 X 24 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, LQFP-176 |
| 文件页数： | 117/142页 |
| 文件大小： | 886K |
| 代理商： | SPC5643AF0MLU2 |
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MPC5644A Microcontroller Data Sheet, Rev. 4
Preliminary—Subject to Change Without Notice
Electrical characteristics
Freescale Semiconductor
76
3.3.1
General notes for specifications at maximum junction temperature
An estimation of the chip junction temperature, TJ, can be obtained from the equation:
TJ = TA + (RJA * PD)
Eqn. 1
where:
TA = ambient temperature for the package (
oC)
RJA = junction-to-ambient thermal resistance (
oC/W)
PD = power dissipation in the package (W)
The thermal resistance values used are based on the JEDEC JESD51 series of standards to provide consistent values for
estimations and comparisons. The difference between the values determined for the single-layer (1s) board compared to a
four-layer board that has two signal layers, a power and a ground plane (2s2p), demonstrate that the effective thermal resistance
is not a constant. The thermal resistance depends on the:
Construction of the application board (number of planes)
Effective size of the board which cools the component
Quality of the thermal and electrical connections to the planes
Power dissipated by adjacent components
Connect all the ground and power balls to the respective planes with one via per ball. Using fewer vias to connect the package
to the planes reduces the thermal performance. Thinner planes also reduce the thermal performance. When the clearance
between the vias leave the planes virtually disconnected, the thermal performance is also greatly reduced.
As a general rule, the value obtained on a single-layer board is within the normal range for the tightly packed printed circuit
board. The value obtained on a board with the internal planes is usually within the normal range if the application board has:
One oz. (35 micron nominal thickness) internal planes
Components are well separated
Overall power dissipation on the board is less than 0.02 W/cm2
The thermal performance of any component depends on the power dissipation of the surrounding components. In addition, the
ambient temperature varies widely within the application. For many natural convection and especially closed box applications,
the board temperature at the perimeter (edge) of the package is approximately the same as the local air temperature near the
device. Specifying the local ambient conditions explicitly as the board temperature provides a more precise description of the
local ambient conditions that determine the temperature of the device.
At a known board temperature, the junction temperature is estimated using the following equation:
TJ = TB + (RJB * PD)
Eqn. 2
where:
TB = board temperature for the package perimeter (
oC)
RJB = junction-to-board thermal resistance (
oC/W) per JESD51-8S
PD = power dissipation in the package (W)
When the heat loss from the package case to the air does not factor into the calculation, an acceptable value for the junction
temperature is predictable. Ensure the application board is similar to the thermal test condition, with the component soldered to
a board with internal planes.
5 Thermal characterization parameter indicating the temperature difference between the package top and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization
parameter is written as Psi-JT.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SPC5643AF0MVZ1 | 功能描述:32位微控制器 - MCU 32BIT3MB Flsh192KRAM RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT |
| SPC5643LF0MLQ1 | 功能描述:32位微控制器 - MCU 32BIT 1M FLASH 128K RAM 120MHZ RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT |
| SPC5643LF0MLQ1R | 功能描述:32位微控制器 - MCU 32B 1M FLASH 128KRAM RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT |
| SPC5643LF0MLQ8 | 功能描述:32位微控制器 - MCU 32BIT1MFLASH 128K RAM RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT |
| SPC5643LF0MLQ8R | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:MPC5643L Microcontroller Data Sheet |
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