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参数资料
| 型号： | SST39VF1602C-70-4I-EKE |
| 厂商： | Microchip Technology |
| 文件页数： | 3/33页 |
| 文件大小： | 0K |
| 描述： | IC FLASH MPF 16MBIT 70NS 48TSOP |
| 标准包装： | 96 |
| 系列： | SST39 MPF™ |
| 格式 - 存储器： | 闪存 |
| 存储器类型： | FLASH |
| 存储容量： | 16M (1M x 16) |
| 速度： | 70ns |
| 接口： | 并联 |
| 电源电压： | 2.7 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 48-TFSOP（0.724"，18.40mm 宽） |
| 供应商设备封装： | 48-TSOP |
| 包装： | 托盘 |
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16 Mbit Multi-Purpose Flash Plus
SST39VF1601C / SST39VF1602C
Data Sheet
To resume Sector-Erase or Block-Erase operation which has
been suspended the system must issue Erase Resume
command. The operation is executed by issuing one byte
command sequence with Erase Resume command (30H)
at any address in the last Byte sequence.
Chip-Erase Operation
The SST39VF1601C/1602C provide a Chip-Erase opera-
tion, which allows the user to erase the entire memory
array to the ‘1’ state. This is useful when the entire device
must be quickly erased.
The Chip-Erase operation is initiated by executing a six-
byte command sequence with Chip-Erase command
(10H) at address 555H in the last byte sequence. The
Erase operation begins with the rising edge of the sixth
WE# or CE#, whichever occurs first. During the Erase
operation, the only valid read is Toggle Bit or Data# Polling.
See Table 7 for the command sequence, Figure 11 for tim-
ing diagram, and Figure 26 for the flowchart. Any com-
mands issued during the Chip-Erase operation are
ignored. When WP# is low, any attempt to Chip-Erase will
be ignored. During the command sequence, WP# should
be statically held high or low.
Write Operation Status Detection
The SST39VF1601C/1602C provide two software means
to detect the completion of a Write (Program or Erase)
cycle, in order to optimize the system write cycle time. The
software detection includes two status bits: Data# Polling
(DQ 7 ) and Toggle Bit (DQ 6 ). The End-of-Write detection
mode is enabled after the rising edge of WE#, which ini-
tiates the internal Program or Erase operation.
The actual completion of the nonvolatile write is asyn-
chronous with the system; therefore, either a Data# Poll-
ing or Toggle Bit read may be simultaneous with the
completion of the write cycle. If this occurs, the system
may possibly get an erroneous result, i.e., valid data may
appear to conflict with either DQ 7 or DQ 6 . In order to pre-
vent spurious rejection, if an erroneous result occurs, the
software routine should include a loop to read the
accessed location an additional two (2) times. If both
reads are valid, then the device has completed the Write
cycle, otherwise the rejection is valid.
Ready/Busy# (RY/BY#)
The devices include a Ready/Busy# (RY/BY#) output sig-
nal. RY/BY# is an open drain output pin that indicates
whether an Erase or Program operation is in progress.
Since RY/BY# is an open drain output, it allows several
devices to be tied in parallel to V DD via an external pull-up
resistor. After the rising edge of the final WE# pulse in the
command sequence, the RY/BY# status is valid.
When RY/BY# is actively pulled low, it indicates that an
Erase or Program operation is in progress. When RY/BY#
is high (Ready), the devices may be read or left in standby
mode.
Data# Polling (DQ 7 )
When the SST39VF1601C/1602C are in the internal Pro-
gram operation, any attempt to read DQ 7 will produce the
complement of the true data. Once the Program operation
is completed, DQ 7 will produce true data. Note that even
though DQ 7 may have valid data immediately following the
completion of an internal Write operation, the remaining
data outputs may still be invalid: valid data on the entire
data bus will appear in subsequent successive Read
cycles after an interval of 1 μs. During internal Erase oper-
ation, any attempt to read DQ 7 will produce a ‘0’. Once the
internal Erase operation is completed, DQ 7 will produce a
‘1’. The Data# Polling is valid after the rising edge of fourth
WE# (or CE#) pulse for Program operation. For Sector-,
Block- or Chip-Erase, the Data# Polling is valid after the
rising edge of sixth WE# (or CE#) pulse. See Figure 9 for
Data# Polling timing diagram and Figure 23 for a flowchart.
?2010 Silicon Storage Technology, Inc.
3
S71380-04-000
05/10
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| SST39VF1602C-70-4I-MAQE | 功能描述:闪存 2.7V to 3.6V 16Mbit Multi-Purpose 闪存 RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel |
| SST39VF160-70-4C-BK | 功能描述:闪存 RO 804-39VF16017CB3K RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel |
| SST39VF160-70-4C-EK | 功能描述:闪存 USE 804-39VF16017CEK RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel |
| SST39VF160-70-4I-BK | 功能描述:闪存 1M X 16 70ns RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel |
| SST39VF160-70-4I-EK | 功能描述:闪存 RO 804-39VF16017CEK RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel |
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