Advance Information
CompactFlash Card Controller
SST55LC100
2005 Silicon Storage Technology, Inc.
S71298-00-000
10/05
61
10.0 ELECTRICAL SPECIFICATIONS
Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum
Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation
of the device at these conditions or conditions greater than those defined in the operational sections of this data
sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.)
Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C
D.C. Voltage on Pins1 I3, I4, O4, and O5 to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VDD+0.5V
1. Please refer to
Table 3-1 for pin assignment information.
Transient Voltage (<20 ns) on Pins1 I3, I4, O4, and O5 to Ground Potential . . . . . . . . . . . . . . . . . -2.0V to VDD+2.0V D.C. Voltage on Pins1 I1, I2, O1, O2, and O6 to Ground Potential. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VDDQ+0.5V Transient Voltage (<20 ns) on Pins1 I1, I2, O1, O2, and O6 to Ground Potential. . . . . . . . . . . . . -2.0V to VDDQ+2.0V Package Power Dissipation Capability (TA = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W
Through Hole Lead Soldering Temperature (10 Seconds). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
Surface Mount Solder Reflow Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C for 10 seconds
Output Short Circuit Current2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
2. Outputs shorted for no more than one second. No more than one output shorted at a time.
TABLE
10-1: ABSOLUTE MAXIMUM POWER PIN STRESS RATINGS
Parameter
Symbol
Conditions
Input Power
VDDQ
VDD
-0.3V min to 6.5V max
-0.3V min to 4.0V max
Voltage on any flash media interface pin with respect to VSS
-0.5V min to VDD + 0.5V max
Voltage on all other pins with respect to VSS
-0.5V min to VDDQ + 0.5V max
T10-1.0 1298
OPERATING RANGE
Range
Ambient Temperature
VDD
VDDQ
Commercial
0°C to +70°C
3.165-3.465V
4.5-5.5V; 3.165-3.465V
Industrial
-40°C to +85°C
3.165-3.465V
4.75-5.25V; 3.165-3.465V
AC CONDITIONS OF TEST
Input Rise/Fall Time . . . . . . . . . . . . . . 10 ns
Output Load . . . . . . . . . . . . . . . . . . . . CL = 100 pF
See
Note: All AC specifications are guaranteed by design.
TABLE
10-2: RECOMMENDED SYSTEM POWER-ON TIMING
Symbol
Parameter
Typical
Maximum
Units
TPU-INITIAL
Drive Initialization to Ready
3 sec + (0.5 sec/GByte)
20
sec
TPU-READY11
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
Host Power-on/Reset to Ready Operation
200
ms
Host Power-on/Reset to Write Operation
200
ms
T10-2.0 1298