参数资料
型号: STM32L152CBT6DTR
厂商: STMICROELECTRONICS
元件分类: 微控制器/微处理器
英文描述: 32-BIT, FLASH, 32 MHz, RISC MICROCONTROLLER, PQFP48
封装: 7 X 7 MM, 0.50 MM PITCH, ROHS COMPLIANT, LQFP-48
文件页数: 46/106页
文件大小: 1417K
代理商: STM32L152CBT6DTR
Electrical characteristics
STM32L151xx, STM32L152xx
Doc ID 17659 Rev 1
6.3
Operating conditions
6.3.1
General operating conditions
5.
When several inputs are submitted to a current injection, the maximum
ΣIINJ(PIN) is the absolute sum of the
positive and negative injected currents (instantaneous values). These results are based on
characterization with
ΣIINJ(PIN) maximum current injection on four I/O port pins of the device.
Table 8.
Thermal characteristics
Symbol
Ratings
Value
Unit
TSTG
Storage temperature range
–65 to +150
°C
TJ
Maximum junction temperature
150
°C
Table 9.
General operating conditions
Symbol
Parameter
Conditions
Min
Max
Unit
fHCLK
Internal AHB clock frequency
0
32
MHz
fPCLK1
Internal APB1 clock frequency
0
32
fPCLK2
Internal APB2 clock frequency
0
32
VDD
Standard operating voltage
BOR detector disabled
1.65
3.6
V
BOR detector enabled,
at power on
1.8
3.6
BOR detector disabled,
after power on
1.65
3.6
VDDA
(1)
1.
When the ADC is used, refer to Table 48: ADC characteristics.
Analog operating voltage
(ADC not used)
Must be the same voltage
as VDD
(2)
2.
It is recommended to power VDD and VDDA from the same source. A maximum difference of 300 mV
between VDD and VDDA can be tolerated during power-up and operation.
1.65
3.6
V
Analog operating voltage
(ADC used)
1.8
3.6
P
D
Power dissipation at
TA = 85 °C
(3)
3.
If TA is lower, higher PD values are allowed as long as TJ does not exceed TJ max (see Table 62: Thermal
LQFP100
434
mW
LQFP64
444
LQFP48
363
LFBGA108
TBD
TFBGA64
308
VFQFN48
TBD
TA
Temperature range
Maximum power dissipation
–40
85
°C
Low power dissipation(4)
–40
105
TJ
Junction temperature range
-40 °C
≤TA ≤105 °C
–40
105
°C
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