参数资料
型号: STPCI2HDYI
厂商: STMICROELECTRONICS
元件分类: 外设及接口
英文描述: MULTIFUNCTION PERIPHERAL, PBGA516
封装: PLASTIC, BGA-516
文件页数: 5/109页
文件大小: 2430K
代理商: STPCI2HDYI
STPC ATLAS
102/109
Issue 1.1 - March 23, 2004
As the PCB acts as a heat sink, the layout of top
and ground layers must be done with care to
maximize the board surface dissipating the heat.
The only limitation is the risk of losing routing
channels. Figure 6-36 and Figure 6-37 show a
routing with a good thermal dissipation thanks to
an optimized placement of power and signal vias.
The ground plane should be on bottom layer for
the best heat spreading (thicker layer than internal
ones) and dissipation (direct contact with air). .
Figure 6-36. Layout for Good Thermal Dissipation - top layer
1
A
3.3V ball
2.5V ball (Core / PLLs)
Via
STPC ball
GND ball
Not Connected ball
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相关代理商/技术参数
参数描述
STPCI2HEYC 功能描述:微处理器 - MPU 133MHz x86 SoC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
STPCI2HEYI 功能描述:微处理器 - MPU 133MHz x86 SoC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
STPCINDUSTRIAL 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:PC Compatible Embedded Microprocessor
STP-CN04 功能描述:烙铁 Cartridge Conical 0.4mm (0.016in) RoHS:否 制造商:Weller 产品:Soldering Stations 类型:Digital, Iron, Stand, Cleaner 瓦特:50 W 最大温度:+ 850 F 电缆类型:US Cord Included
STP-CN05 功能描述:烙铁 Cartridge Conical 0.5mm (0.02in) RoHS:否 制造商:Weller 产品:Soldering Stations 类型:Digital, Iron, Stand, Cleaner 瓦特:50 W 最大温度:+ 850 F 电缆类型:US Cord Included