参数资料
型号: SZNUP4016P5T5G
厂商: ON Semiconductor
文件页数: 1/3页
文件大小: 0K
描述: TVS ARRAY ULT LOW CAP SOT-953
标准包装: 8,000
电压 - 反向隔离(标准值): 5V
电压 - 击穿: 5.5V
电极标记: 4 通道阵列 - 单向
安装类型: *
封装/外壳: *
供应商设备封装: *
包装: *
NUP4016P5T5G,
SZNUP4016P5T5G
Ultra-Low Capacitance
Diode-TVS Array for High
Speed Data Line Protection
The NUP4016P5 transient voltage suppressor is designed to protect
high speed data lines from ESD. Ultra ? low capacitance and high level
of ESD protection makes this device well suited for use in USB 2.0
applications.
Features
? Ultra ? Low Capacitance (0.5 pF Typical Between I/O Lines and
Ground)
http://onsemi.com
SOT ? 953
CASE 527AE
? ESD Rating of Class 3B (Exceeding 8 kV) per Human Body model
and Class C (Exceeding 400 V) per Machine Model
1
5
?
Protection for the Following IEC Standards:
IEC 61000 ? 4 ? 2 15 kV (contact)
2
?
?
?
UL Flammability Rating of 94 V ? 0
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC ? Q101 Qualified and
PPAP Capable
This is a Pb ? Free Device*
3
MARKING DIAGRAM
4
Typical Applications
? High Speed Communication Line Protection
? USB 2.0 High Speed Data Line and Power Line Protection
? Monitors and Flat Panel Displays
? MP3
? Gigabit Ethernet
4M
1
4 = Specific Device Code
M = Date Code
ORDERING INFORMATION
MAXIMUM RATINGS (T J = 25 ? C unless otherwise noted)
Device
Package
Shipping ?
Rating
Operating Junction Temperature Range
Symbol
T J
Value
? 40 to +125
Unit
? C
NUP4016P5T5G
SOT ? 953
(Pb ? Free)
4,000 /
Tape & Reel
Storage Temperature Range
Lead Solder Temperature ?
Maximum (10 Seconds)
Human Body Model (HBM)
Machine Model (MM)
IEC 61000 ? 4 ? 2 Contact (ESD)
T stg
T L
ESD
? 55 to +150
260
16000
400
15000
? C
? C
V
SZNUP4016P5T5G SOT ? 953 4,000 /
(Pb ? Free) Tape & Reel
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
*For additional information on our Pb ? Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
? Semiconductor Components Industries, LLC, 2012
February, 2012 ? Rev. 4
1
Publication Order Number:
NUP4016P5/D
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