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参数资料
| 型号： | SZNUP4016P5T5G |
| 厂商： | ON Semiconductor |
| 文件页数： | 3/3页 |
| 文件大小： | 0K |
| 描述： | TVS ARRAY ULT LOW CAP SOT-953 |
| 标准包装： | 8,000 |
| 电压 - 反向隔离（标准值）： | 5V |
| 电压 - 击穿： | 5.5V |
| 电极标记： | 4 通道阵列 - 单向 |
| 安装类型： | * |
| 封装/外壳： | * |
| 供应商设备封装： | * |
| 包装： | * |
NUP4016P5T5G, SZNUP4016P5T5G
PACKAGE DIMENSIONS
SOT ? 953
CASE 527AE
ISSUE E
PIN ONE
INDICATOR
5
1
D
4
2 3
X
Y
E
A
H E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
MILLIMETERS
TOP VIEW
C
DIM
A
b
C
MIN NOM MAX
0.34 0.37 0.40
0.10 0.15 0.20
0.07 0.12 0.17
e
5X
L
SIDE VIEW
D
E
e
H E
L
L2
L3
0.95 1.00 1.05
0.75 0.80 0.85
0.35 BSC
0.95 1.00 1.05
0.175 REF
0.05 0.10 0.15
??? ??? 0.15
5X
L3
5X
L2
BOTTOM VIEW
5X
b
0.08 X Y
SOLDERING FOOTPRINT*
5X
0.20
5X
0.35
PACKAGE
OUTLINE
1.20
1
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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NUP4016P5/D
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