参数资料
型号: TAS5122DFDR
厂商: TEXAS INSTRUMENTS INC
元件分类: 音频/视频放大
英文描述: 37 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO56
封装: POWERPAD, PLASTIC, TSSOP-56
文件页数: 7/22页
文件大小: 313K
代理商: TAS5122DFDR
TAS5122
SLES088C AUGUST 2003 REVISED NOVEMBER 2003
www.ti.com
15
Figure 11. Inductance Saturation
I Current A
4
5
6
7
8
9
10
11
0
5
10
15
L
Inductance
H
INDUCTANCE
vs
CURRENT
DFB1310A
DASL983XX1023
The selection of the capacitor that is placed across the
output of each inductor (C2 in Figure 10) is very simple. To
complete the output filter, use a 0.47-
F capacitor with a
voltage rating at least twice the voltage applied to the
output stage (PVDD).
This capacitor should be a good quality polyester dielectric
such as a Wima MKS2-047ufd/100/10 or equivalent.
In order to minimize the EMI effect of unbalanced ripple
loss in the inductors, 0.1-
F 50-V SMD capacitors (X7R or
better) (C1A and C1B in Figure 10) should be added from
the output of each inductor to ground.
THERMAL INFORMATION
RθJA is a system thermal resistance from junction to
ambient air. As such, it is a system parameter with roughly
the following components:
D RθJC (the thermal resistance from junction to
case, or in this case the metal pad)
D Thermal grease thermal resistance
D Heat sink thermal resistance
RθJC has been provided in the Package Dissipation
Ratings section.
The thermal grease thermal resistance can be calculated
from the exposed pad area and the thermal grease
manufacturer’s area thermal resistance (expressed in
°C-in2/W). The area thermal resistance of the example
thermal grease with a 0.002 inch thick layer is about 0.1
°C-in2/W. The approximate exposed pad area is as
follows:
56-pin HTSSOP
0.045 in2
Dividing the example thermal grease area resistance by
the surface area gives the actual resistance through the
thermal grease for both ICs inside the package:
56-pin HTSSOP
2.27
°C/W
The thermal resistance of thermal pads is generally
considerably higher than a thin thermal grease layer.
Thermal tape has an even higher thermal resistance.
Neither pads nor tape should be used with either of these
two packages. A thin layer of thermal grease with careful
clamping of the heat sink is recommended. It may be
difficult to achieve a layer 0.001 inch thick or less, so the
modeling below is done with a 0.002 inch thick layer, which
may be more representative of production thermal grease
thickness.
Heat sink thermal resistance is generally predicted by the
heat sink vendor, modeled using a continuous flow
dynamics (CFD) model, or measured.
Thus, for a single monaural IC, the system RθJA = RθJC +
thermal grease resistance + heat sink resistance.
DFD THERMAL INFORMATION
The thermally augmented package provided with the
TAS5122DFD is designed to be interfaced directly to heat
sinks using a thermal interface compound (for example,
Wakefield Engineering type 126 thermal grease.) The heat
sink then absorbs heat from the ICs and couples it to the
local air. If the heatsink is carefully designed, this process
can reach equilibrium and heat can be continually
removed from the ICs. Because of the efficiency of the
TAS5122DFD, heat sinks can be smaller than those
required for linear amplifiers of equivalent performance.
Table 4 and Table 5 indicate modeled parameters for one
or two TAS5122DFD ICs on a single heat sink. The final
junction temperature is set at 110
°C in all cases. It is
assumed that the thermal grease is 0.002 inch thick and
that it is similar in performance to Wakefield Type 126
thermal grease. It is important that the thermal grease
layer is
≤0.002 inches thick and that thermal pads or tape
are not used in the pad-to-heat sink interface due to the
high power density that results in these extreme power
cases.
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