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参数资料
| 型号： | TAS5122DFDR |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 37 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO56 |
| 封装： | POWERPAD, PLASTIC, TSSOP-56 |
| 文件页数： | 8/22页 |
| 文件大小： | 313K |
| 代理商： | TAS5122DFDR |
TAS5122
SLES088C AUGUST 2003 REVISED NOVEMBER 2003
www.ti.com
16
Table 4. Case 1 (2
× 30 W Unclipped Into 6 ,
Both Channels in Same IC) (1)
56-Pin HTSSOP
Ambient temperature
25
°C
Power to load (per channel)
30 W (unclipped)
Power dissipation
2.8 W
Delta T inside package
6.3
°C, note 2 ×
channel dissipation
Delta T through thermal grease
22.8
°C, note 2 ×
channel dissipation
Required heat sink thermal resistance
10.2
°C/W
Junction temperature
110
°C
System RθJA
15.5
°C/W
RθJA * power dissipation
85
°C
Junction temperature
85
°C + 25°C = 110°C
(1) This case represents a stereo system with only one package. See
Case 2 if doing a full-power, 2-channel test in a multichannel
system.
Table 5. Case 2 (2
× 30 W Unclipped Into 6 ,
Channels in Separate Packages) (1)
56-Pin HTSSOP
Ambient temperature
25
°C
Power to load (per channel)
30 W (unclipped)
Power dissipation
2.8 W
Delta T inside package
3.1
°C
Delta T through thermal grease
11.4
°C
Required heat sink thermal resistance
12.8
°C/W
Junction temperature
110
°C
System RθJA
15.5
°C/W
RθJA * power dissipation
85
°C
Junction temperature
85
°C + 25°C = 110°C
(1) In this case, the power is separated into two packages. Note that
this allows a considerably smaller heat sink because twice as much
area is available for heat transfer through the thermal grease. For
this reason, separating the stereo channels into two ICs is
recommended in full-power stereo tests made on multichannel
systems.
DCA THERMAL INFORMATION
The thermally enhanced DCA package is based on the
56-pin HTSSOP, but includes a thermal pad (see
Figure 12) to provide an effective thermal contact between
the IC and the PCB.
The PowerPAD package (thermally enhanced HTSSOP)
combines fine-pitch surface-mount technology with
thermal performance comparable to much larger power
packages.
The PowerPAD package is designed to optimize the heat
transfer to the PWB. Because of the very small size and
limited
mass
of
an
HTSSOP
package,
thermal
enhancement is achieved by improving the thermal
conduction paths that remove heat from the component.
The thermal pad is formed using a patented lead-frame
design and manufacturing technique to provide a direct
connection to the heat-generating IC. When this pad is
soldered or otherwise thermally coupled to an external
heat dissipater, high power dissipation in the ultrathin,
fine-pitch, surface-mount package can be reliably
achieved.
Thermal Methodology for the DCA 56-Pin,
2
y15-W, 8-W Package
The thermal design for the DCA part (e.g., thermal pad
soldered to the board) should be similar to the design as
in the following figures. The cooling approach is to conduct
the dissipated heat into the via pads on the board, through
the vias in the board, and into a heat sink (aluminum bar)
(if necessary).
Figure 12 shows a recommended land pattern on the
PCB.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TAS5122DFDRG4 | 功能描述:音频放大器 Digital Amplifier Power Stage RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TAS5132 | 制造商:TI 制造商全称:Texas Instruments 功能描述:STEREO DIGITAL AMPLIFIER POWER STAGE |
| TAS5132_07 | 制造商:TI 制造商全称:Texas Instruments 功能描述:STEREO DIGITAL AMPLIFIER POWER STAGE |
| TAS5132_0702 | 制造商:TI 制造商全称:Texas Instruments 功能描述:STEREO DIGITAL AMPLIFIER POWER STAGE |
| TAS5132DDV | 功能描述:音频放大器 Stereo 20W Pwrstage RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
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