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| 型号： | TDF8599TD |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 70 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO36 |
| 封装： | PLASTIC, SOT851-2, HSOP-36 |
| 文件页数： | 31/53页 |
| 文件大小： | 329K |
| 代理商： | TDF8599TD |
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TDF8599_2
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 30 July 2009
37 of 53
NXP Semiconductors
TDF8599
I2C-bus controlled dual channel class-D power amplier
14.4 Speaker conguration and impedance
A at-frequency response (due to a 2nd order Butterworth lter) is obtained by changing
the low-pass lter components (LLC, CLC) based on the speaker conguration and
impedance. Table 22 shows the required values.
Remark: When using a 1
load impedance in Parallel mode, the outputs are shorted
after the low-pass lter switches two 2
lters in parallel.
14.5 Heat sink requirements
In some applications, it is necessary to connect an external heat sink to the TDF8599.
Thermal foldback activates at Tj = 145 °C. The expression below shows the relationship
between the maximum power dissipation before activation of thermal foldback and the
total thermal resistance from junction to ambient;
(7)
Pmax is determined by the efciency (η) of the TDF8599. The efciency measured as a
function of output power is given in Figure 39. The power dissipation can be derived as a
function of output power (see Figure 32).
Example 1:
VP = 14.4 V
Po =2 × 25 W into 4 (THD = 10 % continuous)
Tj(max) = 140 °C
Tamb =25 °C
The required Rth(j-a) = 115 °C / 5.8W=19K/W
The total thermal resistance Rth(j-a) consists of: Rth(j-c) + Rth(c-h) + Rth(h-a)
Where:
Thermal resistance from junction to case (Rth(j-c)) = 1.1 K/W
Thermal resistance from case to heat sink (Rth(c-h)) = 0.5 K/W to 1 K/W (depending on
mounting)
Thermal resistance from heat sink to ambient (Rth(h-a)) would then be
19
(1.1+1)=17K/W.
If an audio signal has a crest factor of 10 (the ratio between peak power and average
power = 10 dB) then Tj will be much lower.
Table 22.
Filter component values
Load impedance (
)
LLC (H)
CLC (F)
1
2.5
4.4
2
5
2.2
410
1
R
th j-a
()
T
jmax
()
T
amb
–
P
max
------------------------------------ K/W
[]
=
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TDF8599TD/N2,512 | 功能描述:音频放大器 IC AMP AUDIO PWR 85W D RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TDF8599TD/N2,518 | 功能描述:音频放大器 IC AMP AUDIO PWR 85W D RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TDF8599TH | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:I2C-bus controlled dual channel 43 W/2 W single channel 85 W/1 W class-D power amplifier with load diagnostics |
| TDF8599TH/N2,512 | 功能描述:音频放大器 IC AMP AUDIO PWR 85W D RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TDF8599TH/N2,518 | 功能描述:音频放大器 IC AMP AUDIO PWR 85W D RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
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