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| 型号： | TDF8599TD |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 70 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO36 |
| 封装： | PLASTIC, SOT851-2, HSOP-36 |
| 文件页数： | 42/53页 |
| 文件大小： | 329K |
| 代理商： | TDF8599TD |
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TDF8599_2
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 30 July 2009
47 of 53
NXP Semiconductors
TDF8599
I2C-bus controlled dual channel class-D power amplier
16. Handling information
In accordance with SNW-FQ-611-D. The number of the quality specication can be found
in the Quality Reference Handbook. The handbook can be ordered using the code
9398 510 63011.
17. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note
AN10365 “Surface mount reow
soldering description”.
17.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for ne pitch SMDs. Reow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
17.2 Wave and reow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature prole. Leaded packages,
packages with solder balls, and leadless packages are all reow solderable.
Key characteristics in both wave and reow soldering are:
Board specications, including the board nish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
17.3 Wave soldering
Key characteristics in wave soldering are:
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TDF8599TD/N2,512 | 功能描述:音频放大器 IC AMP AUDIO PWR 85W D RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TDF8599TD/N2,518 | 功能描述:音频放大器 IC AMP AUDIO PWR 85W D RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TDF8599TH | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:I2C-bus controlled dual channel 43 W/2 W single channel 85 W/1 W class-D power amplifier with load diagnostics |
| TDF8599TH/N2,512 | 功能描述:音频放大器 IC AMP AUDIO PWR 85W D RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TDF8599TH/N2,518 | 功能描述:音频放大器 IC AMP AUDIO PWR 85W D RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
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