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参数资料
| 型号： | TLV1571IPWG4 |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | ADC |
| 英文描述： | 1-CH 10-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PDSO24 |
| 封装： | GREEN, TSSOP-24 |
| 文件页数： | 22/33页 |
| 文件大小： | 627K |
| 代理商： | TLV1571IPWG4 |
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PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
TLV1571CDW
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV1571CDWG4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV1571IDW
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV1571IDWG4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLV1571IPW
ACTIVE
TSSOP
PW
24
60
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV1571IPWG4
ACTIVE
TSSOP
PW
24
60
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV1578CDA
ACTIVE
TSSOP
DA
32
46
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV1578CDAG4
ACTIVE
TSSOP
DA
32
46
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV1578CDAR
ACTIVE
TSSOP
DA
32
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV1578CDARG4
ACTIVE
TSSOP
DA
32
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV1578IDA
ACTIVE
TSSOP
DA
32
46
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV1578IDAG4
ACTIVE
TSSOP
DA
32
46
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com
12-Sep-2006
Addendum-Page 1
相关PDF资料 |
PDF描述 |
|---|---|
| TLV1571CDWG4 | 1-CH 10-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PDSO24 |
| TLV1578CDARG4 | 8-CH 10-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PDSO32 |
| TLV1571IDW | 1-CH 10-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PDSO24 |
| TLV1571CPW | 1-CH 10-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PDSO24 |
| TLV1571IDWR | 1-CH 10-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PDSO24 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| TLV1572 | 制造商:TI 制造商全称:Texas Instruments 功能描述:2.7 V TO 5.5 V, 10-BIT, 1.25 MSPS SERIAL ANALOG-TO-DIGITAL CONVERTER WITH AUTO-POWERDOWN |
| TLV1572CD | 功能描述:模数转换器 - ADC 10bit A/D RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32 |
| TLV1572CDG4 | 功能描述:模数转换器 - ADC 10-Bit 1.25 MSPS 1-Ch DSP RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32 |
| TLV1572CDR | 功能描述:模数转换器 - ADC 10-Bit 1.25 MSPS 1-Ch DSP RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32 |
| TLV1572CDRG4 | 功能描述:模数转换器 - ADC 10-Bit 1.25 MSPS 1-Ch DSP RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32 |
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