参数资料
型号: TPS54972PWP
厂商: TEXAS INSTRUMENTS INC
元件分类: 稳压器
英文描述: 16 A SWITCHING REGULATOR, 762 kHz SWITCHING FREQ-MAX, PDSO28
封装: GREEN, PLASTIC, HTSSOP-28
文件页数: 3/19页
文件大小: 411K
代理商: TPS54972PWP
Minimum recommended exposed
copper area for powerpad. 5 mm
stencils may required 10 percent
larger area.
Minimum recommended thermal vias: 8 x
.013 dia. inside powerpad area
4 x .018 dia. under device as shown.
Additional .018 dia. vias may be used if
top side Analog Ground ar ea is
extended.
8 PL 0.0130
4 PL 0.0180
Connect Pin 1 to Analog Ground plane
in this area for optimum performance
Minimum recommended top
side Analog Ground area
0.0339
0.0650
0.0500
0.0650
0.0339
0.3820
0.0150
0.06
0.2090
0.0256
0.1700
0.1340
0.0603
0.0400
0.3478
TPS54972
www.ti.com
SLVS437B – AUGUST 2002 – REVISED AUGUST 2010
LAYOUT CONSIDERATIONS FOR THERMAL PERFORMANCE
For operation at full rated load current, the analog ground plane must provide adequate heat dissipating area. A
3 inch by 3 inch plane of 1 ounce copper is recommended, though not mandatory, depending on ambient
temperature and airflow. Most applications have larger areas of internal ground plane available, and the
PowerPAD should be connected to the largest area available. Additional areas on the top or bottom layers also
help dissipate heat, and any area available should be used when 9 A or greater operation is desired. Connection
from the exposed area of the PowerPAD to the analog ground plane layer should be made using 0.013 inch
diameter vias to avoid solder wicking through the vias. Eight vias should be in the PowerPAD area with four
additional vias located under the device package. The size of the vias under the package, but not in the exposed
thermal pad area, can be increased to 0.018. Additional vias beyond the ten recommended that enhance thermal
performance should be included in areas not under the device package
Figure 10. Recommended Land Pattern for 28-Pin PWP PowerPAD
Copyright 2002–2010, Texas Instruments Incorporated
11
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