参数资料
型号: TPS81256SIPR
厂商: Texas Instruments
文件页数: 1/26页
文件大小: 0K
描述: IC REG BOOST SYNC 5V 0.6A 9USIP
标准包装: 1
类型: 升压(升压)
输出类型: 固定
输出数: 1
输出电压: 5V
输入电压: 2.5 V ~ 5.5 V
PWM 型: 电流模式
频率 - 开关: 4MHz
电流 - 输出: 600mA
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 9-VBGA
包装: 标准包装
供应商设备封装: 9-uSIP(2.6x2.9)
其它名称: 296-30558-6

SLVSAZ9A – JUNE 2012 – REVISED AUGUST 2013
3-W, HIGH EFFICIENCY STEP-UP CONVERTER IN MicroSiP? PACKAGING
Check for Samples: TPS81256
FEATURES
? 91% Efficiency at 4MHz Operation
1
2
? Wide V IN Range From 2.5V to 5.5V
DESCRIPTION
The TPS8125x device is a complete MicroSiP?
DC/DC step-up power solution intended for battery-
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I OUT ≥ 550mA at V OUT = 5.0V, V IN ≥ 3.3V
±2% Total DC Voltage Accuracy
43μA Supply Current
Best-in-Class Line and Load Transient
V IN ≥ V OUT Operation
Low-Ripple Light-Load PFM Mode
True Load Disconnect During Shutdown
Thermal Shutdown and Overload Protection
Sub 1-mm Profile Solution
Total Solution Size <9mm 2
9-Pin MicroSiP TM Packaging
powered portable applications. Included in the
package are the switching regulator, inductor and
input/output capacitors. Only a tiny additional output
capacitor is required to finish the design.
The TPS8125x is based on a high-frequency
synchronous step-up DC/DC converter optimized for
battery-powered portable applications.
The DC/DC converter operates at a regulated 4-MHz
switching frequency and enters power-save mode
operation at light load currents to maintain high
efficiency over the entire load current range.
The PFM mode extends the battery life by reducing
the supply current to 43 μ A (typ) during light load
APPLICATIONS
operation. Intended for low-power applications, the
TPS8125x supports more than 3W output power over
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Cell Phones, Smart-Phones, Tablet PCs
Mono and Stereo APA Applications
USB-OTG, HDMI Applications
USB Charging Port (5V)
a full Li-Ion battery voltage range. Input current in
shutdown mode is less than 1μA (typ), which
maximizes battery life.
The TPS8125x offers a very small solution size of
less than 9mm 2 due to minimum amount of external
components. The solution is packaged in a compact
(2.6mm x 2.9mm) and low profile (1.0mm) BGA
package
suitable
for
automated
assembly
by
100
90
80
70
V O = 5.0 V
standard surface mount equipment.
TPS81256SIP
60
L
DC/DC Converter
L
VOUT
V OUT = 5.0 V
50
40
V IN
2.5 V .. 4.85 V
VIN
.
C O
4.7μF
30
C I
EN
GND
16V X5R (0603)
20
10
ENABLE
0
rren
V I -
Inp
ut V o
lt a g e
-V
I O -
Ou
tpu
t Cu
t-m
A
GND
Figure 2. Smallest Solution Size Application
Figure 1. Efficiency vs. Load Current
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
MicroSiP is a trademark of Texas Instruments.
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright ? 2012–2013, Texas Instruments Incorporated
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