参数资料
| 型号： | TPS81256SIPR |
| 厂商： | Texas Instruments |
| 文件页数： | 21/26页 |
| 文件大小： | 0K |
| 描述： | IC REG BOOST SYNC 5V 0.6A 9USIP |
| 标准包装： | 1 |
| 类型： | 升压（升压） |
| 输出类型： | 固定 |
| 输出数： | 1 |
| 输出电压： | 5V |
| 输入电压： | 2.5 V ~ 5.5 V |
| PWM 型： | 电流模式 |
| 频率 - 开关： | 4MHz |
| 电流 - 输出： | 600mA |
| 同步整流器： | 是 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 9-VBGA |
| 包装： | 标准包装 |
| 供应商设备封装： | 9-uSIP（2.6x2.9） |
| 其它名称： | 296-30558-6 |
PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
20-Feb-2014
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C)
Device Marking
(4/5)
Samples
TPS81256SIPR
ACTIVE
uSiP
SIP
9
3000
Green (RoHS
Call TI
Level-2-260C-1 YEAR
-40 to 85
TT
& no Sb/Br)
TXI256
TPS81256SIPT
ACTIVE
uSiP
SIP
9
250
Green (RoHS
Call TI
Level-2-260C-1 YEAR
-40 to 85
TT
& no Sb/Br)
TXI256
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
(4)
(5)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
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PDF描述 |
|---|---|
| TPS82673SIPR | IC REG BUCK SYNC 1.26V .6A 8USIP |
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| TW-30-07-G-D-563-SM-P | CONN HEADER DUAL 2MM 60POS GOLD |
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|---|---|
| TPS81256SIPT | 功能描述:直流/直流开关转换器 Int Pwr Sol,3W High- Eff SU Converter RoHS:否 制造商:STMicroelectronics 最大输入电压:4.5 V 开关频率:1.5 MHz 输出电压:4.6 V 输出电流:250 mA 输出端数量:2 最大工作温度:+ 85 C 安装风格:SMD/SMT |
| TPS813 | 制造商:TOSHIBA 制造商全称:Toshiba Semiconductor 功能描述:PHOTO IC SILICON EPITAXIAL PLANAR |
| TPS813(F) | 制造商:Toshiba 功能描述:Cut Tape |
| TPS814 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Silicon Epitaxial Planar Photo IC |
| TPS816 | 制造商:TOSHIBA 制造商全称:Toshiba Semiconductor 功能描述:LEAD FREE PRODUCT PHOTO-ELECTRIC SWITCHES |
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