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参数资料
| 型号： | TSPC603PVG6LE |
| 厂商： | ATMEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 166 MHz, RISC PROCESSOR, CBGA255 |
| 封装： | 21 MM, 3.16 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 |
| 文件页数： | 4/38页 |
| 文件大小： | 599K |
| 代理商： | TSPC603PVG6LE |
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TSPC603P
12/38
3.4. Recommended operating conditions
These are the recommended and tested operating conditions. Proper device operation outside of these conditions is not guaranteed.
Parameter
Symbol
Min
Max
Unit
Core supply voltage
Vdd
2.375
2.625
V
PLL supply voltage
AVdd
2.375
2.625
V
I/O supply voltage
OVdd
3.135
3.465
V
Input voltage
Vin
GND
5.5
V
Operating temperature
Tc
-55
+125
°C
3.5. Thermal characterisrics
3.5.1.CQFP240 package
This section provides thermal management data for the 603p ; this information is based on a typical desktop configuration using a 240
lead, 32 mm x 32 mm, wire-bond CQFP package. The heat sink used for this data is a pinfin configuration from Thermalloy, part
number 2338.
3.5.1.1. Thermal characteristics
The thermal characteristics for a wire-bond CQFP package are as follows :
Thermal resistance (junction-to-case) = Rqjc or qjc = 2.2°C/Watt.
Wire–bond CQFP die junction–to–lead thermal resistance (typical) =
q JB = 18°C/W
3.5.1.2. Thermal management example
The following example is based on a typical desktop configuration using a wire-bond CQFP package. The heat sink used for this data
is a pinfin heat sink #2338 attached to the wire-bond CQFP package with thermal grease.
Figure 5 provides a thermal management example for the CQFP package.
0
5
10
15
20
25
30
35
012
345
Junction-to-Ambient
thermal
Resistance
(degreeC/Watt)
Forced convection (m/sec)
Motorola Wire-Bond CQFP
With Heat Sink
Figure 5 : CQFP thermal management exemple
The junction temperature can be calculated from the junction to ambient thermal resistance, as follows :
Junction temperature :
Tj = Ta + Rqja * P
or
Tj = Ta + (Rqjc + Rcs + Rsa) * P
Where :
Ta is the ambient temperature in the vicinity of the device
Rqja is the junction-to-ambient thermal resistance
Rqjc is the junction-to-case thermal resistance of the device
Rcs is the case-to-heat sink thermal resistance of the interface material
Rsa is the heat sink-to-ambient thermal resistance
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相关代理商/技术参数 |
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| TSPC603R | 制造商:ATMEL 制造商全称:ATMEL Corporation 功能描述:PowerPC 603e RISC Microprocessor Family PID7t-603e |
| TSPC603RCAB/Q8L | 制造商:ATMEL 制造商全称:ATMEL Corporation 功能描述:PowerPC 603e RISC Microprocessor Family PID7t-603e |
| TSPC603RCAB/Q8LC | 制造商:ATMEL 制造商全称:ATMEL Corporation 功能描述:PowerPC 603e RISC Microprocessor Family PID7t-603e |
| TSPC603RMAB/Q8L | 制造商:ATMEL 制造商全称:ATMEL Corporation 功能描述:PowerPC 603e RISC Microprocessor Family PID7t-603e |
| TSPC603RMAB/Q8LC | 制造商:ATMEL 制造商全称:ATMEL Corporation 功能描述:PowerPC 603e RISC Microprocessor Family PID7t-603e |
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