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参数资料
| 型号： | TZA3019AVH |
| 英文描述： | TRANSIL |
| 中文描述： | 特定应用功放|双| LLCC | 32脚|塑料 |
| 文件页数： | 25/28页 |
| 文件大小： | 138K |
| 代理商： | TZA3019AVH |
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2003 Apr 02
25
Philips Semiconductors
Product specification
30 Mbits/s up to 3.2 Gbits/s
A-rate
TM
laser drivers
TZA3011A; TZA3011B
15.5
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
For more detailed information on the BGA packages refer to the“(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
6.
PACKAGE
(1)
SOLDERING METHOD
WAVE
REFLOW
(2)
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA
DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, HVSON, SMS
PLCC
(4)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
not suitable
not suitable
(3)
suitable
suitable
suitable
not recommended
(4)(5)
not recommended
(6)
suitable
suitable
suitable
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PDF描述 |
|---|---|
| TZA3019BVH | TRANSIL |
| TZA3019CVH | TRANSIL |
| TZA3015HW | 30 Mbit/s to 3.2 Gbit/s A-rate 4-bit fibre optic transceiver |
| Z00607DA | SENSITIVE GATE TRIACS |
| Z00607DA1BA2 | SENSITIVE GATE TRIACS |
相关代理商/技术参数 |
参数描述 |
|---|---|
| TZA3019BHT | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:2.5 Gbits/s dual postamplifier with level detectors and 2 x 2 switch |
| TZA3019BV | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:2.5 Gbits/s dual postamplifier with level detectors and 2 x 2 switch |
| TZA3019BVH | 制造商:未知厂家 制造商全称:未知厂家 功能描述:APPLICATION SPECIFIC AMPLIFIER|DUAL|LLCC|32PIN|PLASTIC |
| TZA3019CHT | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:2.5 Gbits/s dual postamplifier with level detectors and 2 x 2 switch |
| TZA3019CV | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:2.5 Gbits/s dual postamplifier with level detectors and 2 x 2 switch |
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