参数资料
型号: TZA3019AVH
英文描述: TRANSIL
中文描述: 特定应用功放|双| LLCC | 32脚|塑料
文件页数: 5/28页
文件大小: 138K
代理商: TZA3019AVH
2003 Apr 02
5
Philips Semiconductors
Product specification
30 Mbits/s up to 3.2 Gbits/s
A-rate
TM
laser drivers
TZA3011A; TZA3011B
6
PINNING
SYMBOL
PIN
PAD
(1)
DESCRIPTION
GND
die pad
substrate common ground plane for V
CCA
, V
CCD
, V
CCO
, RF and I/O; must be connected to
ground
1
analog supply voltage
2
analog supply voltage
3
digital supply voltage
4
digital supply voltage
5
non-inverted data input (RF input)
6
inverted data input (RF input)
7
ground
8
ground
9
ground
10
ground
11
test pin or test pad; must be connected to ground
12
non-inverted clock input (RF input)
13
inverted clock input (RF input)
ground
14
ground
15
alarm reset input; resets ALMON and ALOP alarms
16
enable input for modulation and bias current
17
ground
18
alarm output on operating current (open-drain)
19
alarm output on monitor diode current (open-drain)
20
internally connected
21
threshold level input for alarm on operating current
22
internally connected
23
temperature dependent voltage output source
24
threshold level input for alarm on monitor diode current
25
reference current input; must be connected to ground with an accurate (1%)
10 k
resistor
26
ground
27
pulse width adjustment input
ground
28
ground
29
inverted laser modulation output (RF output); output for dummy load
30
inverted laser modulation output (RF output); output for dummy load
31
inverted laser modulation output (RF output); output for dummy load
32
inverted laser modulation output (RF output); output for dummy load
33
ground
34
internally connected
35
ground
V
CCA
V
CCA
V
CCD
V
CCD
DIN
DINQ
GNDRF
GNDRF
GNDRF
GNDRF
TEST
CIN
CINQ
GND
GNDESD
ALRESET
ENABLE
GNDDFT
ALOP
ALMON
i.c.
MAXOP
i.c.
VTEMP
MAXMON
RREF
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
GNDRF
PWA
GND
GNDO
LAQ
LAQ
LAQ
LAQ
GNDO
i.c.
GNDO
17
18
19
20
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