参数资料
型号: TZA3019AVH
英文描述: TRANSIL
中文描述: 特定应用功放|双| LLCC | 32脚|塑料
文件页数: 27/28页
文件大小: 138K
代理商: TZA3019AVH
2003 Apr 02
27
Philips Semiconductors
Product specification
30 Mbits/s up to 3.2 Gbits/s
A-rate
TM
laser drivers
TZA3011A; TZA3011B
Bare die
All die are tested and are guaranteed to
comply with all data sheet limits up to the point of wafer
sawing for a period of ninety (90) days from the date of
Philips' delivery. If there are data sheet limits not
guaranteed, these will be separately indicated in the data
sheet. There are no post packing tests performed on
individual die or wafer. Philips Semiconductors has no
control of third party procedures in the sawing, handling,
packing or assembly of the die. Accordingly, Philips
Semiconductors assumes no liability for device
functionality or performance of the die or systems after
third party sawing, handling, packing or assembly of the
die. It is the responsibility of the customer to test and
qualify their application in which the die is used.
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